Browsing by author "Potoms, Goedele"
Now showing items 1-20 of 24
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3D stacking using bump-less process for sub 10μm pitches
Derakhshandeh, Jaber; De Preter, Inge; Gerets, Carine; Hou, Lin; Heylen, Nancy; Beyne, Eric; Beyer, Gerald; Slabbekoorn, John; Dubey, Vikas; Jourdain, Anne; Potoms, Goedele; Inoue, Fumihiro; Jamieson, Geraldine; Vandersmissen, Kevin; Suhard, Samuel; Webers, Tomas; Capuz, Giovanni; Wang, Teng; Rebibis, Kenneth June; Miller, Andy (2016) -
4X reticles with 3% linewidth control for the development of 0.18 µm lithography
Jonckheere, Rik; Moonens, Jos; Potoms, Goedele; Bovie, Inge; Van den hove, Luc (1996) -
A unique temporary bond solution based on a thermoplastic material tacky at room temperature and highly thermally resistant application extension from 3D-SIC to FO-WLP
Phommahaxay, Alain; Nakamura, Atsushi; Potoms, Goedele; Bertheau, Julien; Bex, Pieter; Duval, Fabrice; Podpod, Arnita; Verbinnen, Greet; Kamochi, Yoshitaka; Sawano, Mitsuru; Beyer, Gerald; Sleeckx, Erik; Beyne, Eric (2017) -
Advances in thin wafer debonding and ultra thin 28nm FinFET substrate transfer
Phommahaxay, Alain; Guerrero, Alice; Jourdain, Anne; Potoms, Goedele; Verbinnen, Greet; Bai, Dongshun; Yess, Kim; Arnold, Kim; Sleeckx, Erik; Beyer, Gerald; Beyne, Eric (2017) -
An alternative 3D packaging route thru wafer reconstruction
Cadacio Jr., Francisco; Wang, Teng; Salahouelhadj, Abdellah; Capuz, Giovanni; Gerets, Carine; Potoms, Goedele; Verwoerdt, Rudy; Rebibis, Kenneth June; Beyer, Gerald; Miller, Andy; Beyne, Eric; Brouwer, Erik (2015) -
CMOS compatible anodization process for low cost high density capacitors
Detalle, Mikael; Rakowski, Michal; Potoms, Goedele; Mercha, Abdelkarim; de Potter de ten Broeck, Muriel; Phommahaxay, Alain; Sabuncuoglu Tezcan, Deniz; Soussan, Philippe (2010) -
CMOS compatible anodization process for low cost high density capacitors
Detalle, Mikael; Rakowski, Michal; Potoms, Goedele; Mercha, Abdelkarim; de Potter de ten Broeck, Muriel; Phommahaxay, Alain; Sabuncuoglu Tezcan, Deniz; Soussan, Philippe (2010) -
Comprehensive Performance and Reliability Assessment of Se-based Selector-Only Memory
Ravsher, Taras; Degraeve, Robin; Garbin, Daniele; Clima, Sergiu; Fantini, Andrea; Donadio, Gabriele Luca; Kundu, Shreya; Devulder, Wouter; Hody, Hubert; Potoms, Goedele; Van Houdt, Jan; Afanasiev, Valeri; Belmonte, Attilio; Kar, Gouri Sankar (2024) -
Cu-Cu insertion bonding technique using photosensitive polymer as WLUF
Potoms, Goedele; Wang, Teng; Derakhshandeh, Jaber; Daily, Robert; Capuz, Giovanni; Gonzalez, Mario; Beyer, Gerald; Rebibis, Kenneth June; Miller, Andy; Beyne, Eric (2014) -
Electrical Demonstration of Sn-S-Based OTS Materials From Theoretical Design for Sustainable Innovation
Garbin, Daniele; Ravsher, Taras; Devulder, Wouter; Clima, Sergiu; Potoms, Goedele; Belmonte, Attilio; Kar, Gouri Sankar (2024) -
Extremely low force debonding of thinned CMOS substrate by laser release of a temporary bond material
Phommahaxay, Alain; Potoms, Goedele; Verbinnen, Greet; Sleeckx, Erik; Beyer, Gerald; Beyne, Eric; Guerrero, Alice; Donghun, Bai; Xiao, Liu; Yess, Kim; Arnold, Kim; Spiess, Walter; Griesbach, Tim; Rapps, Thomas; Lutter, Stefan (2016) -
Feature proximity errors on mask: assessment results of commercially obtained reticles
Jonckheere, Rik; Potoms, Goedele; Philipsen, Vicky (2003-01) -
First demonstration of vertically stacked ferroelectric Al doped HfO2 devices for NAND applications
Florent, Karine; Lavizzari, Simone; Di Piazza, Luca; Popovici, Mihaela Ioana; Vecchio, Emma; Potoms, Goedele; Groeseneken, Guido; Van Houdt, Jan (2017) -
From planar to vertical capacitors : a first step towards ferroelectric V-FeFET integration
Florent, Karine; Lavizzari, Simone; Di Piazza, Luca; Popovici, Mihaela Ioana; Potoms, Goedele; Raymaekers, Tom; Groeseneken, Guido; Van Houdt, Jan (2017) -
High density, low leakage back-end 3D capacitors for mixed signals applications
Detalle, Mikael; Barrenetxea, Mikel; Muller, Philippe; Potoms, Goedele; Phommahaxay, Alain; Soussan, Philippe; Vaesen, Kristof; De Raedt, Walter (2010) -
High-Endurance Ferroelectric (La, Y) and (La, Gd) Co-Doped Hafnium Zirconate Grown by Atomic Layer Deposition
Popovici, Mihaela Ioana; Walke, Amey; Bizindavyi, Jasper; Meersschaut, Johan; Banerjee, Kaustuv; Potoms, Goedele; Katcko, Kostantine; Van den Bosch, Geert; Delhougne, Romain; Kar, Gouri Sankar; Van Houdt, Jan (2022) -
High-performance (EOT<0.4nm, Jg~10-7A/cm2) ALD-deposited Ru\SrTiO3 stack for next generations DRAM pillar capacitor
Popovici, Mihaela Ioana; Belmonte, Attilio; Oh, Hyungrock; Potoms, Goedele; Meersschaut, Johan; Richard, Olivier; Hody, Hubert; Van Elshocht, Sven; Delhougne, Romain; Goux, Ludovic; Kar, Gouri Sankar (2018) -
Impact of wafer thinning on front-end reliability for 3D integration
Vaisman Chasin, Adrian; Scholz, Mirko; Guo, Wei; Franco, Jacopo; Potoms, Goedele; Jourdain, Anne; Linten, Dimitri; Van der Plas, Geert; Absil, Philippe; Beyne, Eric (2016) -
Improvement of thermal stability in high density Ta2O5 3D capacitor by additional thin SiO2 layer
Detalle, Mikael; Dekkers, Harold; Potoms, Goedele; Phommahaxay, Alain; Sabuncuoglu Tezcan, Deniz; Soussan, Philippe; Beyer, Gerald (2011) -
Integration challenges of Cu pillars with extreme wafer thinning for 3D stacking and packaging
Buisson, Thibault; Potoms, Goedele; Phommahaxay, Alain; Verbinnen, Greet; Jaenen, Patrick; La Manna, Antonio; Travaly, Youssef; Beyne, Eric (2011)