Browsing by author "Truffert, Vincent"
Now showing items 1-20 of 28
-
A new paradigm for in-line detection and control of patterning defects
Hunsche, Stefan; Jochemsen, Marinus; Jain, Vivek; Zhou, Xinjian; Chen, Frank; Vellanki, Venu; Spence, Chris; Halder, Sandip; Van Den Heuvel, Dieter; Truffert, Vincent (2015) -
Advanced optical lithography: double patterning options for 32 and 22nm node
Vandeweyer, Tom; Maenhoudt, Mireille; Vangoidsenhoven, Diziana; Gronheid, Roel; Versluijs, Janko; Miller, Andy; Bekaert, Joost; Truffert, Vincent; Wiaux, Vincent (2009) -
Challenges in setting up the patterning processes for a 16nm node SRAM cell
Ercken, Monique; Vandeweyer, Tom; Versluijs, Janko; Truffert, Vincent; De Backer, Johan; Delvaux, Christie; Baerts, Christina (2010) -
Combined illumination sources for hyper-NA contact hole printing
Bekaert, Joost; Truffert, Vincent; Willems, Patrick; Van Look, Lieve; Op de Beeck, Maaike; Hendrickx, Eric; Vandenberghe, Geert (2007) -
Comparing positive and negative tone development process for printing the metal and contact layers of the 32- and 22-nm node
Bekaert, Joost; Van Look, Lieve; Truffert, Vincent; Lazzarino, Frederic; Vandenberghe, Geert; Reybrouck, Mario; Tarutani, Shinji (2010-12) -
Etch challenges of a spin-on trilayer resist system for narrow pitch dual damascene patterning
Lazzarino, Frederic; Wilson, Chris; Truffert, Vincent; Vereecke, Bart; Demuynck, Steven; de Marneffe, Jean-Francois; Baklanov, Mikhaïl (2012) -
EUV outgassing and contamination in multilayer material schemes
Pollentier, Ivan; Truffert, Vincent; Lokasani, Ragava; Gronheid, Roel (2011) -
Full-field EUV and immersion lithography integration in 0.186μm² FinFET 6T-SRAM cell
Veloso, Anabela; Demuynck, Steven; Ercken, Monique; Goethals, Mieke; Demand, Marc; de Marneffe, Jean-Francois; Altamirano Sanchez, Efrain; De Keersgieter, An; Delvaux, Christie; De Backer, Johan; Brus, Stephan; Hermans, Jan; Baudemprez, Bart; Van Roey, Frieda; Lorusso, Gian; Baerts, Christina; Goossens, Danny; Vrancken, Christa; Mertens, Sofie; Versluijs, Janko; Truffert, Vincent; Huffman, Craig; Laidler, David; Heylen, Nancy; Ong, Patrick; Parvais, Bertrand; Rakowski, Michal; Verhaegen, Staf; Hikavyy, Andriy; Meiling, H.; Hultermans, B.; Romijn, L.; Pigneret, C.; Lok, S.; Van Dijk, A.; Shah, K.; Noori, A.; Gelatos, J.; Arghavani, R.; Schreutelkamp, Rob; Boelen, Pieter; Richard, Olivier; Bender, Hugo; Witters, Liesbeth; Collaert, Nadine; Rooyackers, Rita; Absil, Philippe; Lauwers, Anne; Jurczak, Gosia; Hoffmann, Thomas Y.; Vanhaelemeersch, Serge; Cartuyvels, Rudi; Ronse, Kurt; Biesemans, Serge (2008) -
High yield sub-0.1μm² 6T-SRAM Cells, featuring high-k/metal-gate Finfet devices, double gate patterning, a novel Fin etch strategy, full-field EUV lithography and optimized junction design & layout
Horiguchi, Naoto; Demuynck, Steven; Ercken, Monique; Locorotondo, Sabrina; Lazzarino, Frederic; Altamirano Sanchez, Efrain; Huffman, Craig; Brus, Stephan; Demand, Marc; Struyf, Herbert; De Backer, Johan; Hermans, Jan; Delvaux, Christie; Vandeweyer, Tom; Baerts, Christina; Mannaert, Geert; Truffert, Vincent; Verluijs, j; Alaerts, Wilfried; Dekkers, Harold; Ong, Patrick; Heylen, Nancy; Kellens, Kristof; Volders, Henny; Hikavyy, Andriy; Vrancken, Christa; Rakowski, Michal; Verhaegen, Staf; Vandenberghe, Geert; Beyer, Gerald; Lauwers, Anne; Absil, Philippe; Hoffmann, Thomas Y.; Ronse, Kurt; Biesemans, Serge (2010) -
Image contrast metrology for EUV lithography
Brunner, Timothy A.; Truffert, Vincent; Ausschnitt, Kit; Kissoon, Nicola N.; Duriau, Edouard; Jonckers, Tom; van Look, Lieve; Franke, Joern-Holger (2022-09-29) -
Immersion lithography and double patterning in advanced microelectronics
Vandeweyer, Tom; Bekaert, Joost; Ercken, Monique; Gronheid, Roel; Miller, Andy; Truffert, Vincent; Verhaegen, Staf; Versluijs, Janko; Wiaux, Vincent; Wong, Patrick; Vandenberghe, Geert; Maenhoudt, Mireille (2010) -
Inspection challenges for triple patterning at sub-14 nm nodes with broadband plasma inspection platforms
Halder, Sandip; Truffert, Vincent; Van Den Heuvel, Dieter; Leray, Philippe; Cheng, Shaunee; McIntyre, Greg; Sah, Kaushik; Brown, Jim; Parisi, Paolo; Polli, Marco (2015) -
Integration of a k=2.3 spin-on polymer for the sub-28nm technology node
Wilson, Chris; Lazzarino, Frederic; Truffert, Vincent; Kirimura, Tomoyuki; de Marneffe, Jean-Francois; Verdonck, Patrick; Hirai, M.; Nakatani, K.; Tada, M.; Heylen, Nancy; El-Mekki, Zaid; Vanstreels, Kris; Van Besien, Els; Ciofi, Ivan; Stucchi, Michele; Croes, Kristof; Zhang, Liping; Demuynck, Steven; Ercken, Monique; Xu, Kaidong; Baklanov, Mikhaïl; Tokei, Zsolt (2012) -
Key factors to sustain the extension of a MHM-based integration scheme to medium and high porosity PECVD low-k materials
Travaly, Youssef; Van Aelst, Joke; Truffert, Vincent; Verdonck, Patrick; Dupont, Tania; Camerotto, Elisabeth; Richard, Olivier; Bender, Hugo; Croes, Kristof; De Roest, David; Vereecke, Guy; Claes, Martine; Le, Quoc Toan; Kesters, Els; Van Cauwenberghe, Marc; Beynet, Julien; Kaneko, S.; Struyf, Herbert; Baklanov, Mikhaïl; Matsushita, K.; Kobayashi, N.; Sprey, Hessel; Beyer, Gerald (2008) -
Metrology of Thin Resist for High NA EUVL
Lorusso, Gian; Beral, Christophe; Bogdanowicz, Janusz; De Simone, Danilo; Hasan, Mahmudul; Jehoul, Christiane; Moussa, Alain; Saib, Mohamed; Zidan, Mohamed; Severi, Joren; Truffert, Vincent; Van Den Heuvel, Dieter; Goldenshtein, Alex; Houchens, Kevin; Santoro, Gaetano; Fischer, Daniel; Muellender, Angelika; Hung, Joey; Koret, Roy; Turovets, Igor; Ausschnitte, Kit; Mack, Chris; Kondo, Tsuyoshi; Shohjoh, Tomoyasu; Ikota, Masami; Charley, Anne-Laure; Leray, Philippe (2022) -
Narrow pitch dual damascene patterning using EUV lithography in association with a spin-on trilayer resist system
Lazzarino, Frederic; Truffert, Vincent; Vereecke, Bart; Demuynck, Steven (2011) -
Novel monitoring of EUV litho cluster for manufacturing insertion
Truffert, Vincent; Ausschnitt, Kit; Nair, Vineet Vijayakrishnan; D'have, Koen (2020) -
Optimized illumination sources for through-pitch contact hole printing at 1.20 and 1.35NA.
Bekaert, Joost; Truffert, Vincent; Willems, Patrick; Van Look, Lieve; Op de Beeck, Maaike; Hendrickx, Eric; Vandenberghe, Geert (2007) -
Patterning capabilities of 40-nm contact holes at 80-nm pitch: EUV vs. Line/Space double exposure immersion lithography
Lazzarino, Frederic; Truffert, Vincent; Bekaert, Joost; Demuynck, Steven; Goethals, Mieke; Struyf, Herbert (2010) -
Patterning challenges in setting up a 16nm node 6T-SRAM device using EUV lithography
Vandeweyer, Tom; De Backer, Johan; Versluijs, Janko; Truffert, Vincent; Verhaegen, Staf; Ercken, Monique; Dusa, Mircea (2011)