Browsing Conference contributions by imec author "9a3f5b55388fd5940a3af83230927fc25a1adf4d"
Now showing items 1-20 of 44
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A novel low temperature etch approach to reduce ULK plasma damage
Zhang, Liping; de Marneffe, Jean-Francois; Leroy, F.; Ljazouli, R.; Lefaucheux, P.; Tillocher, T; Dussart, R.; Maekawa, K.; Yatsuda, K.; Dussarrat, C.; De Gendt, Stefan; Baklanov, Mikhaïl (2015) -
Adsorption isobars of fluorocarbon compounds selected for cryogenic etching of low-k materials
Rezvanov, A.; Mogilnikov, K.; Gutshin, O.; Gornev, E.; Krasnikov, G.; Zhang, Liping; Dussarrat, C.; de Marneffe, Jean-Francois; Baklanov, Mikhaïl (2015) -
Alternative integration of ultra low-k dielectrics by template replacement approach
Zhang, Liping; de Marneffe, Jean-Francois; Heylen, Nancy; Murdoch, Gayle; Tokei, Zsolt; Boemmels, Juergen; De Gendt, Stefan; Baklanov, Mikhaïl (2015) -
An experimental study of VUV plasma damage on porous organo-silicon glass materials
de Marneffe, Jean-Francois; Lukaszewicz, Mikolaj; Heyne, Markus; Zhang, Liping; Baklanov, Mikhaïl (2013-02) -
Applications of cryogenic plasma etching for microtechnology and advanced CMOS manufacturing
Dussart, R.; Lefaucheux, P.; Tillocher, T.; Ranson, P.; Boufnichel, M.; Ljazouli, R.; Zhang, Liping; Mankelevich, Y.; de Marneffe, Jean-Francois; De Gendt, Stefan; Baklanov, Mikhaïl (2013) -
Aspect ratio independent Plasma etching for silicon STI
Han, Yang; Zhang, Liping; Altamirano Sanchez, Efrain (2019) -
Challenges and approaches in advanced Fin patterning
Zhang, Liping; Hellin, David; Altamirano Sanchez, Efrain (2019) -
Cryoetching of silicon and advanced materials for 3D interconnects
Dussart, R.; Tillocher, T.; Gosset, N; Lefaucheux, P.; L'jazouli, R; Boufnichel, M.; Zhang, Liping; de Marneffe, Jean-Francois; Baklanov, Mikhaïl; Nishimura, E; Yatsuda, K; Maekawa, K (2014) -
Cryoetching processes applied to ULK material
Leroy, Floriane; Tillocher, Thomas; Lefaucheux, Philippe; Dussart, Remi; yatsuda, koichi; Maekawa, Kaoru; Dussarat, Christian; Zhang, Liping; de Marneffe, Jean-Francois; Baklanov, Mikhaïl (2015) -
Cryogenic etching of porous organosilicate low-k materials: fluorine based plasma analysis
Leroy, F; Tillocher, T; Zhang, Liping; Girard, A.; Cardinaud, C.; Lefaucheux, P.; de Marneffe, Jean-Francois; Dussart, R.; Maekawa, K; Yatsuda, K; Baklanov, Mikhaïl (2015) -
Cryogenic etching of porous organosilicate low-k materials: reduction of plasma induced damage
Leroy, F.; Tillocher, T.; Zhang, Liping; Lefaucheux, P.; Yatsuda, K.; Maekawa, K.; de Marneffe, Jean-Francois; Baklanov, Mikhaïl; Dussart, R (2015) -
Cryogenic etching vs P4 approaches: paths towards ultra-low damage integration of mesoporous oxide dielectric materials
de Marneffe, Jean-Francois; Zhang, Liping; Heyne, Markus; Krishtab, Mikhail; Goodyear, Andy; Cooke, Mike; Heylen, Nancy; Ciofi, Ivan; Wen, Liang Gong; Wilson, Chris; Rutigliani, Vito; Decoster, Stefan; Savage, Travis; Matsunaga, Koichi; Nafus, Kathleen; Boemmels, Juergen; Tokei, Zsolt; Baklanov, Mikhaïl (2014) -
Damage free cryogenic etch of ultra low-k materials: recent experimental results and theoretical analysis
Baklanov, Mikhaïl; Zhang, Liping; Dussart, Remi; de Marneffe, Jean-Francois (2013) -
Damage free cryogenic etching of porous organosilica ultralow-k film
Zhang, Liping; Liazouli, Remi; Dussart, Rami; Lefaucheux, Philippe; Tillocher, Thomas; de Marneffe, Jean-Francois; De Gendt, Stefan; Mankelevich, Yuri; Baklanov, Mikhaïl (2012) -
Effect of 147 nm radiation on a 2.0 porous organo-Silicon glass
de Marneffe, Jean-Francois; Lukaszewicz, Mikolaj; Porter, Stephen; Zhang, Liping; Heyne, Markus; Baklanov, Mikhaïl (2013) -
Effect of 147nm photons on porous Organo-Silicon Glass materials and damage improvement by optimized Cu/low-k integration approaches
Zhang, Liping; de Marneffe, Jean-Francois; Lukaszewicz, Mikolaj; Barry-Porter, Stephen; Vajda, Felim; Sun, Yiting; Heyne, Markus; Baklanov, Mikhaïl; Rutiqlian, Vito (2014) -
FEOL dry etch process challenges of ultimate FinFET scaling and next generation device architectures beyond N3
Tao, Zheng; Zhang, Liping; Dupuy, Emmanuel; Chan, BT; Altamirano Sanchez, Efrain; Lazzarino, Frederic (2020) -
First demonstration of monocrystalline silicon macaroni channel for 3-D NAND memory devices
Delhougne, Romain; Arreghini, Antonio; Rosseel, Erik; Hikavyy, Andriy; Vecchio, Emma; Zhang, Liping; Pak, Murat; Nyns, Laura; Raymaekers, Tom; Jossart, Nico; Breuil, Laurent; Vadakupudhu Palayam, Senthil; Tan, ChiLim; Van den Bosch, Geert; Furnemont, Arnaud (2018) -
First demonstration of MOVPE In1-xGaxAs macaroni channel for 3-D NAND memory devices
Ramesh, Siva; Vadakupudhu Palayam, Senthil; Rosseel, Erik; Arreghini, Antonio; Kunert, Bernardette; Baryshnikova, Marina; Zhang, Liping; Ong, Patrick; Teugels, Lieve; Pak, Murat; Jossart, Nico; Raymaekers, Tom; Stiers, Jimmy; Van den Bosch, Geert; Furnemont, Arnaud (2019) -
High thermal stability and high VUV absorption polymer for the P4/pore stuffing approach
Rutigliani, Vito; Zhang, Liping; de Marneffe, Jean-Francois; Cao, Yi; Noya, G.; Baklanov, Mikhaïl (2015)