Browsing Conference contributions by imec author "ef81b9280b113989bed4db9958d4caa89e57b8a3"
Now showing items 1-20 of 107
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21 nm Pitch dual-damascene BEOL process integration with full barrierless Ru metallization
Vega Gonzalez, Victor; Wilson, Chris; Paolillo, Sara; Decoster, Stefan; Mao, Ming; Versluijs, Janko; Blanco, Victor; Kesters, Els; Le, Quoc Toan; Lorant, Christophe; Varela Pedreira, Olalla; Lesniewska, Alicja; Heylen, Nancy; El-Mekki, Zaid; van der Veen, Marleen; Webers, Tomas; Vats, Hemant; Rynders, Luc; Cupak, Miroslav; Lee, Jae Uk; Drissi, Youssef; Halipre, Luc; Charley, Anne-Laure; Verdonck, Patrick; Witters, Thomas; Van Gompel, Sander; Kimura, Yosuke; Jourdan, Nicolas; Ciofi, Ivan; Contino, Antonino; Boccardi, Guillaume; Lariviere, Stephane; De Wachter, Bart; Vancoille, Eric; Lazzarino, Frederic; Ercken, Monique; Kim, Ryan Ryoung han; Trivkovic, Darko; Croes, Kristof; Leray, Philippe; Pardons, Katrien; Barla, Kathy; Tokei, Zsolt (2019) -
28nm pitch single exposure patterning readiness by metal oxide resist on 0.33NA EUV Lithography
Kim, Il Hwan; Kim, Insung; Park, Changmin; Lee, Jsiun; Ryu, Koungmin; De Schepper, P.; Doise, J.; Kocsis, M.; De Simone, Danilo; Kljucar, Luka; Das, Poulomi; Blanc, Romuald; Beral, Christophe; Severi, Joren; Vandenbroeck, Nadia; Foubert, Philippe; Charley, Anne-Laure; Oak, Apoorva; Xu, Dongbo; Gillijns, Werner; Mitard, Jerome; Tokei, Zsolt; van der Veen, Marleen; Heylen, Nancy; Teugels, Lieve; Le, Quoc Toan; Schleicher, Filip; Leray, Philippe; Ronse, Kurt (2021) -
A novel approach to characterise a low-k dielectric polymer surface
Martin Hoyas, Ana; Schuhmacher, Jorg; Le, Quoc Toan; Whelan, Caroline; Schaekers, Marc; Celis, Jean-Pierre; Maex, Karen (2002) -
A study in interactions of plasmas and wet cleans with ULK materials
Xu, Kaidong; Vereecke, Guy; Kesters, Els; Le, Quoc Toan; Lux, Marcel; Kraus, Harald; Henry, Sally - Ann; Archer, L.; Gaulhofer, E.; Kovacs, F.; Dalmer, M.; Mertens, Paul; Luo, S. J; Han, Q. Y (2007) -
Acoustic cleaning in nano-electronics
Mertens, Paul; Janssens, Tom; Holsteyns, Frank; Zijlstra, Aaldert; Halder, Sandip; Wostyn, Kurt; Andreas, Michael; Hoyer, Ronald; Barbagini, Francesca; Wada, Masayuki; Franklin, Cole; Kim, Tae-Gon; Kim, K; Kenis, Karine; Le, Quoc Toan; Claes, Martine; Kesters, Els; Vos, Rita; Vereecke, Guy; Bearda, Twan; Heyns, Marc (2008) -
All wet strip approaches for post-etch photoresist layers after low-k patterning
Claes, Martine; Le, Quoc Toan; Kesters, Els; Lux, Marcel; Urionabarrenetxea, Ainara; Vereecke, Guy; Mertens, Paul; Carleer, R.; Adriaensens, P. (2007) -
All-wet removal of post-etch photoresist and sidewall residues: Electrical characterization of 90 nm and 30 nm ½ pitch structures
Le, Quoc Toan; Demuynck, Steven; Suhard, Samuel; Klipp, Andreas; Vereecke, Bart; Vereecke, Guy (2010) -
Alternative metal recess for fully-self-aligned-vias
Contino, Antonino; Le, Quoc Toan; Sakamoto, Kei; Schleicher, Filip; Paolillo, Sara; Pacco, Antoine; Kesters, Els; Lorant, Christophe; Murdoch, Gayle; Lariviere, Stephane; Vega Gonzalez, Victor; Versluijs, Janko; Jaenen, Patrick; Teugels, Lieve; van der Veen, Marleen; Jourdan, Nicolas; Ciofi, Ivan; Boccardi, Guillaume; Tokei, Zsolt; Wilson, Chris (2020) -
Alternative photoresist removal process to minimize damage of low-k material induced by ash plasma
Le, Quoc Toan; Keldermans, Johan; Chiodarelli, Nicolo; Kesters, Els; Lux, Marcel; Claes, Martine; Vereecke, Guy (2007-11) -
An environment friendly wet strip process for 193 nm lithography patterning in BEOL applications
Vereecke, Guy; Kesters, Els; Le, Quoc Toan; Claes, Martine; Lux, Marcel; Struyf, Herbert; Carleer, Robert; Adriaensens, Peter (2012) -
Application of surface and interface characterization of materials in back-end-of-line interconnect
Le, Quoc Toan; Kesters, Els; Altamirano Sanchez, Efrain; Holsteyns, Frank (2019) -
Application of UV irradiation in removal of post-etch 193 nm photoresist
Le, Quoc Toan; Kesters, Els; Prager, Lutz; Lux, Marcel; Marsik, Premysl; Vereecke, Guy (2009) -
BEOL pre-metallization wet clean: post-etch residue removal and metal compatibility
Le, Quoc Toan; Kesters, Els; Akanishi, Yuya; Iwasaki, Akihisa; Holsteyns, Frank (2018) -
Buried Power Rail Metal exploration towards the 1 nm Node
Gupta, Anshul; Radisic, Dunja; Maes, J.W.; Varela Pedreira, Olalla; Soulie, Jean-Philippe; Jourdan, Nicolas; Mertens, Hans; Bandyopadhyay, Sudip; Le, Quoc Toan; Pacco, Antoine; Heylen, Nancy; Vandersmissen, Kevin; Devriendt, Katia; Zhu, C.; Datta, S.; Sebaai, Farid; Wang, S.; Mousa, M.; Lee, J.; Geypen, Jef; De Wachter, Bart; Chehab, Bilal; Salahuddin, Shairfe Muhammad; Murdoch, Gayle; Biesemans, Serge; Tokei, Zsolt; Dentoni Litta, Eugenio; Horiguchi, Naoto (2021) -
Challenges and novel approaches for photo resist removal and post-etch residue removal for 22 nm interconnects
Mertens, Paul; Kim, Tae-Gon; Claes, Martine; Le, Quoc Toan; Vereecke, Guy; Kesters, Els; Suhard, Samuel; Pacco, Antoine; Lux, Marcel; Kenis, Karine; Urbanowicz, Adam; Tokei, Zsolt; Beyer, Gerald (2009) -
Challenges in BEOL cleaning for the 10 nm node and beyond
Yu, David; Le, Quoc Toan; Braun, Simon; Kesters, Els; Shen, Mary; Klipp, Andreas; Holsteyns, Frank (2014) -
Challenges in uniform etching of Ruthenium
Le, Quoc Toan; Verdonck, Patrick; Pacco, Antoine; Altamirano Sanchez, Efrain (2021) -
Challenges of clean/strip processing for Cu/LowK technology
Baklanov, Mikhaïl; Le, Quoc Toan; Kesters, Els; Iacopi, Francesca; Van Aelst, Joke; Struyf, Herbert; Boullart, Werner; Vanhaelemeersch, Serge; Maex, Karen (2004) -
Characterization and removal of post-etch residues in interconnect patterning
Le, Quoc Toan; de Marneffe, Jean-Francois; Conard, Thierry; Lux, Marcel; Vereecke, Guy (2010) -
Characterization of etch residues generated on damascene structures
Le, Quoc Toan; Kesters, Els; Hoflijk, Ilse; Conard, Thierry; Shen, M.; Braun, S.; Burk, Y.; Holsteyns, Frank (2016)