Browsing Conference contributions by imec author "ef81b9280b113989bed4db9958d4caa89e57b8a3"
Now showing items 41-60 of 107
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Efficient cleaning of low-k materials using single-wafer cleaning solution: a compatibility study and electrical characterization
Le, Quoc Toan; Van Olmen, Jan; Vanderheyden, Rudi; Kesters, Els; Kenis, Karine; Conard, Thierry; Boullart, Werner; Baklanov, Mikhaïl; Vanhaelemeersch, Serge (2005) -
Etch residue formation and growth on patterned porous dielectrics: angle-resolved XPS and Infrared characterization
Le, Quoc Toan; Kesters, Els; Holsteyns, Frank (2017) -
Evaluation of gas cluster ion beam processing for sealing af a porous dielectric
Brongersma, Sywert; Sherman, S.; Tabat, M.; Patz, Michael; Beyer, Gerald; Travaly, Youssef; Le, Quoc Toan; Caluwaerts, Rudy; Hautala, J. (2005-01) -
Evaluation of post etch residue cleaning solutions for the removal of TiN hardmask after dry etch of low-k dielectric materials on 45 nm pitch interconnects
Payne, Makonnen; Lippy, Steve; Lieten, Ruben; Kesters, Els; Le, Quoc Toan; Murdoch, Gayle; Vega Gonzalez, Victor; Holsteyns, Frank (2016) -
Evaluation of the degree of damage after different conditions of He/H2 dry strip plasma on silica-based porous low-k materials - compatiblity study with chemical solutions
Kesters, Els; Le, Quoc Toan; Boullart, Werner; Han, Q.; Berry, I.; Waldfried, C.; Mertens, Paul; Heyns, Marc (2005) -
Feasibility study of fully self aligned vias for 5nm node BEOL
Murdoch, Gayle; Boemmels, Juergen; Wilson, Chris; Babaei Gavan, Khashayar; Le, Quoc Toan; Tokei, Zsolt; Clark, William (2017) -
First demonstration of Two Metal Level Semi-damascene Interconnects with Fully Self-aligned Vias at 18MP
Murdoch, Gayle; O'Toole, Martin; Marti, Giulio; Pokhrel, Ankit; Tsvetanova, Diana; Decoster, Stefan; Kundu, Souvik; Oniki, Yusuke; Thiam, Arame; Le, Quoc Toan; Varela Pedreira, Olalla; Lesniewska, Alicja; Martinez Alanis, Gerardo Tadeo; Park, Seongho; Tokei, Zsolt (2022-06-15) -
Formation of fluorocarbon polymer and its removal in back-end-of-line processing of advanced CMOS integrated circuits
Le, Quoc Toan; Vereecke, Guy; Kesters, Els; Struyf, Herbert; De Gendt, Stefan (2012-11) -
Functional water solutions to enable wet cleaning process for leading edge semiconductor device manufacturing
Kesters, Els; Hideaki, Iino; Yuichi, Ogawa; Oniki, Yusuke; Le, Quoc Toan; Holsteyns, Frank (2019) -
HF etching mechanisms of advanced low-k films
Verdonck, Patrick; Le, Quoc Toan; Krishtab, Mikhail; Vanstreels, Kris; Armini, Silvia; Simone, A.; Nguyen, Mai Phuong; Van Elshocht, Sven; Baklanov, Mikhaïl (2014) -
Impact of curing condition on chemical stability of ultralow-k PMO material
Krishtab, Mikhail; Zhang, Liping; Le, Quoc Toan; Vanstreels, Kris; Souriau, Laurent; Phillips, Mark; Baklanov, Mikhaïl (2012) -
Impact of dissolved oxygen in dilute HF solution on material etch
Kesters, Els; Iwasaki, Akihisa; Le, Quoc Toan; Holsteyns, Frank (2016) -
Impact of UV cure time and wavelength on chemical, mechanical and electrical properties of PECVD deposited porous ultra low-k films
Godavarthi, Srinivas; Le, Quoc Toan; Verdonck, Patrick; Mardani, Shabnam; Vanstreels, Kris; Van Besien, Els; Baklanov, Mikhaïl (2012-03) -
Inflection points in interconnect research and trends for 2nm and beyond in order to solve the RC bottleneck
Tokei, Zsolt; Vega Gonzalez, Victor; Murdoch, Gayle; O'Toole, Martin; Croes, Kristof; Baert, Rogier; van der Veen, Marleen; Adelmann, Christoph; Soulie, Jean-Philippe; Boemmels, Juergen; Wilson, Chris; Park, Seongho; Sankaran, Kiroubanand; Pourtois, Geoffrey; Swerts, Johan; Paolillo, Sara; Decoster, Stefan; Mao, Ming; Lazzarino, Frederic; Versluijs, Janko; Blanco, Victor; Ercken, Monique; Kesters, Els; Le, Quoc Toan; Holsteyns, Frank; Heylen, Nancy; Teugels, Lieve; Devriendt, Katia; Struyf, Herbert; Morin, Pierre; Jourdan, Nicolas; Van Elshocht, Sven; Ciofi, Ivan; Gupta, Anshul; Zahedmanesh, Houman; Vanstreels, Kris; Na, Myung Hee (2020) -
Influence of UV irradiation on the removal of post-etch photoresist in porous low-k dielectric patterning
Kesters, Els; Le, Quoc Toan; Lux, Marcel; Onandia, Laura; Baerts, Christina; Vereecke, Guy (2009) -
Influence of UV irradiation on the removal of post-etch photoresist in porous low-k dielectric patterning
Kesters, Els; Le, Quoc Toan; Lux, Marcel; Baerts, Christina; Onandia, Laura; Vereecke, Guy (2009) -
Integration of wet cleaning in 45 nm pitch BEOL processing
Kesters, Els; Le, Quoc Toan; Lazzarino, Frederic; Decoster, Stefan; Wilson, Chris; Holsteyns, Frank; De Gendt, Stefan (2013) -
Interaction of a variety of ashing plasma with MSQ low-k dielectric
Le, Quoc Toan; Patz, M.; Struyf, Herbert; Baklanov, Mikhaïl; Boullart, Werner; Vanhaelemeersch, Serge; Maex, Karen (2004) -
Interconnects for scaled SRAM with vertical Surrounded Gate Transistors (SGT)
Boemmels, Juergen; Harada, N.; Kim, Min-Soo; Mitard, Jerome; Kikuchi, Yoshiaki; Li, Waikin; Tao, Zheng; Puliyalil, Harinarayanan; Devriendt, Katia; Lorant, Christophe; Le, Quoc Toan; Kesters, Els; Jourdan, Nicolas; El-Mekki, Zaid; Teugels, Lieve; van der Veen, Marleen; Li, Y.; Nakamura, H.; Mocuta, Dan; Masuoka, F. (2019) -
Key factors to sustain the extension of a MHM-based integration scheme to medium and high porosity PECVD low-k materials
Travaly, Youssef; Van Aelst, Joke; Truffert, Vincent; Verdonck, Patrick; Dupont, Tania; Camerotto, Elisabeth; Richard, Olivier; Bender, Hugo; Croes, Kristof; De Roest, David; Vereecke, Guy; Claes, Martine; Le, Quoc Toan; Kesters, Els; Van Cauwenberghe, Marc; Beynet, Julien; Kaneko, S.; Struyf, Herbert; Baklanov, Mikhaïl; Matsushita, K.; Kobayashi, N.; Sprey, Hessel; Beyer, Gerald (2008)