Browsing Presentations by imec author "3ca9d28abb4589eab351f8d0d1d5980ff85c3998"
Now showing items 1-20 of 37
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A high-reliable Cu/ULK integration scheme using Metal Hard Mask and Low-k capping film
Travaly, Youssef; Tsutsue, M.; Ikeda, Atsushi; Verdonck, Patrick; Tokei, Zsolt; Willegems, Myriam; Van Aelst, Joke; Struyf, Herbert; Vereecke, Guy; Kesters, Els; Le, Quoc Toan; Claes, Martine; Heylen, Nancy; Sinapi, Fabrice; Richard, Olivier; De Roest, David; Kaneko, S; Kemeling, N; Fukazawa, A; Matsuki, N; Matsushita, K; Tsuji, N; Kagami, K; Sprey, Hessel; Beyer, Gerald (2007) -
A unique temporary bond solution based on a thermoplastic material tacky at room temperature and highly thermally resistant application extension from 3D-SIC to FO-WLP
Phommahaxay, Alain; Nakamura, Atsushi; Potoms, Goedele; Bertheau, Julien; Bex, Pieter; Duval, Fabrice; Podpod, Arnita; Verbinnen, Greet; Kamochi, Yoshitaka; Sawano, Mitsuru; Beyer, Gerald; Sleeckx, Erik; Beyne, Eric (2017) -
Advanced capabilities and applications of a sputter-RBS system
Brijs, Bert; Deleu, Jeroen; Beyer, Gerald; Vandervorst, Wilfried (1998) -
Advanced solutions for copper and low k technology
Beyer, Gerald; Baklanov, Mikhaïl; Brongersma, Sywert; De Roest, David; Donaton, R.; Grillaert, Joost; Lanckmans, Filip; Maenhoudt, Mireille; Maex, Karen; Richard, Emmanuel; Struyf, Herbert; Stucchi, Michele; Tokei, Zsolt; Van Hove, Marleen; Vervoort, Iwan (2000) -
Carbon nanotube interconnects: electrical characterization of CNT contacts with Cu damascene top contact
van der Veen, Marleen; Vereecke, Bart; Huyghebaert, Cedric; Cott, Daire; Masahito, Sugiura; Yusaku, Kashiwagi; Teugels, Lieve; Caluwaerts, Rudy; Beyer, Gerald; Heyns, Marc; Tokei, Zsolt; De Gendt, Stefan (2011) -
Cu contact technology for sub-100nm contacts
Demuynck, Steven; Zhao, Chao; Hinomura, Toru; Tokei, Zsolt; Van den Bosch, Geert; Beyer, Gerald (2007) -
Effects of UV-cure on mechanical, physical and electrical properties of microporous SiOC:H dielectric films
Iacopi, Francesca; Waldfried, Carlo; Abell, Thomas; Guyer, Eric; Eyckens, Brenda; Travaly, Youssef; Sajavaara, Timo; Gage, David M.; Beyer, Gerald; Berry, Ivan; Dauskardt, Reinhold; Maex, Karen (2005) -
Electrical evaluation and TEM/SEm investigation of a bottomless I-PVD Ta(N) barrier in a damascene architecture
Yamagishi, Hajime; Tokei, Zsolt; Beyer, Gerald; Donaton, R. A.; Bender, Hugo; Nogami, T.; Maex, Karen (2000) -
Electromigration study of ultra narrow copper lines in low-k dielectric
Croes, Kristof; Moon, Kwang Jin; Carbonell, Laure; Struyf, Herbert; Heylen, Nancy; Tokei, Zsolt; Beyer, Gerald (2007) -
Evaluating k-values for low-k materials after damascene integration: method and results for 90nm half pitch
Vereecke, Bart; Pantouvaki, Marianna; Beyer, Gerald; Tokei, Zsolt (2010) -
Highly reliable Cu/ULK integratrion scheme using MHM and low-k capping film
Tsutsue, Makoto; Travaly, Youssef; Ikeda, Atsushi; Tokei, Zsolt; Willegems, Myriam; Struyf, Herbert; Sinapi, Fabrice; Richard, Olivier; Kemeling, Nathan; De Roest, David; Fukuzawa, A.; Matsuki, N.; Sprey, Hessel; Beyer, Gerald (2007) -
IMP liners for all speed fill
Beyer, Gerald; Maex, Karen; Daniels, Stephen; Maity, Nirmalya; Bassanini, Davide (1998) -
Impact of "terminal effect" on Cu plating: options and roadmap
Armini, Silvia; Tokei, Zsolt; Volders, Henny; El-Mekki, Zaid; Radisic, Alex; Beyer, Gerald; Ruythooren, Wouter; Vereecken, Philippe (2010) -
Impact of line height on copper resistivity and interconnect RC delay: a geometry approach to reduce the size effect
Zhang, Wenqi; Brongersma, Sywert; Van Aelst, Joke; Richard, Olivier; Bamal, Mandeep; Heylen, Nancy; Li, Yunlong; Beyer, Gerald; Maex, Karen (2005) -
In-situ growth of Cu-Mn alloy self-forming barriers in 100 nm Cu/Low-k damascene interconnects
Wilson, Chris; Volders, Henny; Tokei, Zsolt; Croes, Kristof; Pantouvaki, Marianna; Beyer, Gerald; Horsfall, A.B.; O'Neill, A.G. (2009) -
Integration of 50 nm half pitch single damascene copper trenches in BDII by means of double patterning 193 nm immersion lithography on metal hardmask
Van Olmen, Jan; Al-Bayati, A; Beyer, Gerald; Boelen, Pieter; Carbonell, Laure; Zhao, Chao; Ciofi, Ivan; Claes, Martine; Cockburn, Andrew; Druais, Gael; Hendrickx, Dirk; Heylen, Nancy; Kesters, Els; Lytle, S.; Noori, A.; Op de Beeck, Maaike; Struyf, Herbert; Tokei, Zsolt; Versluijs, Janko (2007) -
Integration of an organic ultra low-k (k=2.2) material
Pantouvaki, Marianna; Zhao, Larry; Huffman, Craig; Heylen, Nancy; Ferchichi, Abdelkarim; Ono, Y.; Nakajima, M.; Nakatani, K.; Struyf, Herbert; Beyer, Gerald; Baklanov, Mikhaïl (2009) -
Integration of porogen-based low-k films: influence of capping layer thickness and long thermal anneals on low-k damage and reliability
De Roest, David; Vereecke, Bart; Huffman, Craig; Heylen, Nancy; Croes, Kristof; Arai, H.; Takamure, N.; Beynet, Julien; Sprey, Hessel; Matsushita, K.; Kobayashi, N.; Verdonck, Patrick; Demuynck, Steven; Beyer, Gerald; Tokei, Zsolt (2009) -
Integration of unlanded via in a non-etchback SOG direct-on-metal approach in 0.25 micron CMOS process
Gao, Teng; Coenegrachts, Bart; Waeterloos, Joost; Beyer, Gerald; Meynen, Herman; Van Hove, Marleen; Maex, Karen (1998) -
Integrations of Cu and low-k dielectrics: effect of hard mask dry etch and post-CMP clean on electrical performance of damascene structures
Donaton, R. A.; Coenegrachts, Bart; Maenhoudt, Mireille; Pollentier, Ivan; Struyf, Herbert; Vanhaelemeersch, Serge; Grillaert, Joost; Fyen, Wim; Beyer, Gerald; Stucchi, Michele; Richard, Emmanuel; Vervoort, Iwan; De Roest, David; Maex, Karen (2000)