Browsing by Author "Henson, Kirklen"
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Publication 45nm nMOSFET with metal gate on thin SiON driving 1150μA/μm and off-state of 10nA/μm
;Henson, Kirklen ;Lander, Rob; ;Dachs, Charles; ;Deweerd, WimProceedings paper2004, Technical Digest International Electron Devices Meeting - IEDM, 13/12/2004, p.851-854Publication A comparison of spike, flash, SPER and laser annealing for 45nm CMOS
Proceedings paper2003, CMOS Front-End Materials and Process Technology, 21/04/2003, p.261-266Publication A practical baseline process for advanced CMOS devices research
Proceedings paper2003, Proceedings 33rd European Solid-State Device Research Conference - ESSDERC, 16/09/2003, p.27-30Publication Advanced PMOS device architecture for highly-doped ultra-shallow junctions
Journal article2004, Japanese J. of Appl. Phys. Part 1, (43) 4B, p.1778-1783Publication Alternative gate insulator materials for future generation MOSFETs
Oral presentation2001, International Forum on Semiconductor Technology - IFST; 7-8 March 2001; Antwerpen, Belgium.Publication An effective model for analysing tunneling gate leakage currents through ultrathin oxides and high-k gate stacks from Si inversion layers
Journal article2004, Solid-State Electronics, (48) 4, p.617-625Publication An investigation of the electron tunneling leakage current through ultrathin oxides/high-k gate stacks at inversion conditions
Proceedings paper2003, IEEE International Conference on Simulation of Semiconductor Processes and Devices - SISPAD, 3/09/2003, p.287-290Publication Analysis of leakage currents and impact on off-state power consumption for CMOS technology in the 100-nm regime
Journal article2000, IEEE Trans. Electron Devices, (47) 7, p.1393-1400Publication Arsenic junction thermal stability and high-dose boron-pocket activation during SPER in nMOS transistors
Journal article2007, IEEE Electron Device Letters, (28) 3, p.198-200Publication Challenges in scaling of CMOS devices towards 65nm node
Proceedings paper2003-06, Diagnostic and Yield, 23/06/2003Publication Channel engineering and junction overlap issues for ultra-shallow junctions formed by SPER in the 45 nm CMOS technology node
Proceedings paper2004-04, Silicon Front-End Junction Formation - Physics and Technology, 8/04/2004, p.455-460Publication Channel engineering towards a full low temperature process solution for the 45 nm technology node
Proceedings paper2004, Proceedings of the 34th European Solid-State Device Research Conference - ESSDERC, 21/09/2004, p.225-229Publication CMOS scaling beyond the 90 nm CMOS technology node: shallow junction and integration challenges
Proceedings paper2003, Ultra Shallow Junctions. 7th Int. Worksh. Fabrication, Characterization and Modeling of Ultra Shallow Doping Profiles in Semic., 27/04/2003, p.15-22Publication Demonstration of fully Ni-silicided metal gates on HfO2 based high-k gate dielectrics as a candidate for low power applications
Proceedings paper2004-06, Technical Digest VLSI Technology Symposium, 15/06/2004, p.190-191Publication Device characteristics of ultra-shallow junctions formed by fRTP annealing
Proceedings paper2004, Silicon Front-End Junction Formation - Physics and Technology, 12/04/2004, p.C1.3Publication Effects of pre-amorphization implantation (PAI) in ultra shallow junctions formed by SPER in deep sub-micron devices
Proceedings paper2004-01, 5th European Workshop on Ultimate Integration of Silicon - ULIS, 20/03/2004, p.69-72Publication Gate dielectrics for high performance and low power CMOS SoC applications
;Cubaynes, Florence ;Dachs, Charles ;Detcheverry, Celine ;Zegers, A.Venezia, VincentProceedings paper2002, ESSDERC - 32nd European Solid-State Device Research Conference, 24/09/2002, p.427-430Publication High k dielectric materials prepared by atomic layer CVD
Oral presentation2001, 12th INFOS Conference - Insulating Films on Semiconductors; June 2001; Udine, Italy.Publication Impact of channel engineering technology on HC performance of 100 nm MOSFETs
Proceedings paper2001, Proceedings of the 31st European Solid-State Device Research Conference, 11/09/2001, p.283-286Publication Implementation of high-k and metal gate materials for the 45nm node and beyond: gate patterning development
Journal article2005-06, Microelectronics Reliability, (45) 5_6, p.1007-1011
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