Browsing by Author "Iacovo, Serena"
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Publication A Study of SiCN Wafer-to-Wafer Bonding and Impact of Wafer Warpage
; ; ; ; Publication Addressing Integration Challenges in Direct Backside Contact of CFET
Proceedings paper2025, IEEE International Interconnect Technology Conference (IITC), 2025-06-02Publication Addressing Integration Challenges in Direct Backside Contact of CFET
Proceedings paper2025, IEEE International Interconnect Technology Conference (IITC), 2025-06-02Publication Advances in SiCN-SiCN bonding with high accuracy wafer-to-wafer (W2W) stacking technology
Proceedings paper2018, IEEE International Interconnect Technology Conference - IITC, 4/06/2018, p.985-992Publication Area-Selective Electroless Deposition of Cu for Hybrid Bonding
Journal article2021, IEEE ELECTRON DEVICE LETTERS, (42) 12, p.1826-1829Publication Bonding induced distortion in wafer-to-wafer bonding applications: how the scanner and Yieldstar can enable 3D integration
Proceedings paper2024, 2024 International Interconnect Technology Conference, 2024-06-03Publication Characterization of bonding activation sequences to enable ultra-low Cu/SiCN wafer level hybrid bonding
Publication Characterization of silicon carbon nitride for low temperature wafer-to-wafer direct bonding
Meeting abstract2020, PRiME 2020: Semiconductor Wafer Bonding: Science, Technology, and Applications 16, 4/10/2020, p.G01-1650Publication Characterization of silicon carbon nitride for low temperature wafer-to-wafer direct bonding
Proceedings paper2020, PRiME 2020: Semiconductor Wafer Bonding: Science, Technology, and Applications 16, 4/10/2020Publication Characterization of Siliconcarbonitride bonding layer for plasma activated direct fusion bonding
Proceedings paper2024, 2024 International Interconnect Technology Conference, JUN 03-06, 2024Publication Controlled sulfurization process for the synthesis of large area MoS2 films and MoS2-WS2 heterostructures
Journal article2016, Advanced Materials Interfaces, (3) 4, p.DOI: 10.1002/adPublication Defect identification in bonding surface layer by positron annihilation spectroscopy
Proceedings paper2019, 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2019), 21/05/2019Publication Development of wafer-level adhesive bonding for fine-pitch 3-D connections
; ; ; ; ; Meeting abstract2017, The International Conference on Wafer Bonding - Waferbond, 27/10/2017Publication Direct bonding of low temperature heterogeneous dielectrics
; ; ; ; ; Proceedings paper2019, 69th IEEE Electronic Components and Technology Conference (ECTC), MAY 29-31, 2019, p.2206-2212Publication Direct Bonding Using Low Temperature SiCN Dielectrics
Proceedings paper2022, 72nd IEEE Electronic Components and Technology Conference (ECTC), MAY 31-JUN 01, 2022, p.602-607Publication Enabling ultra-thin die to wafer hybrid bonding for future heterogeneous integrated systems
Meeting abstract2019, 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 28/05/2019, p.607-613Publication ESD process assessment of 2.5D and 3D bonding technologies
; ; ; ; ; Proceedings paper2023, 45th Annual Electrical Overstress/Electrostatic Discharge (EOS/ESD) Symposium, OCT 02-04, 2023Publication Exploring Bonding Mechanism of SiCN for Hybrid Bonding
Proceedings paper2024, IEEE 74th Electronic Components and Technology Conference (ECTC), MAY 28-31, 2024, p.1953-1957Publication Extreme thinned-wafer bonding using low temperature curable polyimide for advanced waferlevel integrations
Proceedings paper2018, IEEE 68th Electronic Components Technology Conference - ECTC, 29/05/2017, p.86-91Publication Film Characterization of Low-Temperature Silicon Carbon Nitride for Direct Bonding Applications
; ; ; ; ; Journal article2020, ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, (9) 12, p.123011
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