Browsing by Author "Iacovo, Serena"
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Publication A Study of SiCN Wafer-to-Wafer Bonding and Impact of Wafer Warpage
; ; ; ; Publication Advances in SiCN-SiCN bonding with high accuracy wafer-to-wafer (W2W) stacking technology
Proceedings paper2018, IEEE International Interconnect Technology Conference - IITC, 4/06/2018, p.985-992Publication Area-Selective Electroless Deposition of Cu for Hybrid Bonding
Journal article2021, IEEE ELECTRON DEVICE LETTERS, (42) 12, p.1826-1829Publication Characterization of bonding activation sequences to enable ultra-low Cu/SiCN wafer level hybrid bonding
Publication Characterization of silicon carbon nitride for low temperature wafer-to-wafer direct bonding
Proceedings paper2020, PRiME 2020: Semiconductor Wafer Bonding: Science, Technology, and Applications 16, 4/10/2020Publication Characterization of silicon carbon nitride for low temperature wafer-to-wafer direct bonding
Meeting abstract2020, PRiME 2020: Semiconductor Wafer Bonding: Science, Technology, and Applications 16, 4/10/2020, p.G01-1650Publication Characterization of Siliconcarbonitride bonding layer for plasma activated direct fusion bonding
Proceedings paper2024, 2024 International Interconnect Technology Conference, JUN 03-06, 2024Publication Controlled sulfurization process for the synthesis of large area MoS2 films and MoS2-WS2 heterostructures
Journal article2016, Advanced Materials Interfaces, (3) 4, p.DOI: 10.1002/adPublication Defect identification in bonding surface layer by positron annihilation spectroscopy
Proceedings paper2019, 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2019), 21/05/2019Publication Development of wafer-level adhesive bonding for fine-pitch 3-D connections
; ; ; ; ; Meeting abstract2017, The International Conference on Wafer Bonding - Waferbond, 27/10/2017Publication Direct bonding of low temperature heterogeneous dielectrics
; ; ; ; ; Proceedings paper2019, 69th IEEE Electronic Components and Technology Conference (ECTC), MAY 29-31, 2019, p.2206-2212Publication Direct Bonding Using Low Temperature SiCN Dielectrics
Proceedings paper2022, 72nd IEEE Electronic Components and Technology Conference (ECTC), MAY 31-JUN 01, 2022, p.602-607Publication Enabling ultra-thin die to wafer hybrid bonding for future heterogeneous integrated systems
Meeting abstract2019, 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 28/05/2019, p.607-613Publication ESD process assessment of 2.5D and 3D bonding technologies
; ; ; ; ; Proceedings paper2023, 45th Annual Electrical Overstress/Electrostatic Discharge (EOS/ESD) Symposium, OCT 02-04, 2023Publication Exploring Bonding Mechanism of SiCN for Hybrid Bonding
Proceedings paper2024, IEEE 74th Electronic Components and Technology Conference (ECTC), MAY 28-31, 2024, p.1953-1957Publication Extreme thinned-wafer bonding using low temperature curable polyimide for advanced waferlevel integrations
Proceedings paper2018, IEEE 68th Electronic Components Technology Conference - ECTC, 29/05/2017, p.86-91Publication Film Characterization of Low-Temperature Silicon Carbon Nitride for Direct Bonding Applications
; ; ; ; ; Journal article2020, ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, (9) 12, p.123011Publication Influence of composition of SiCN as interfacial layer on plasma activated direct bonding
Journal article2019, ECS Journal of Solid State Science and Technology, (8) 6, p.P346-P350Publication Influence of composition of SiCN for surface activated bonding
; ; ; ; ; Proceedings paper2018, Semiconductor Wafer Bonding: Science, Technology, and Applications 15, 30/09/2018, p.159-168Publication Introduction of a New Carrier System for Collective Die-to-Wafer Hybrid Bonding and Laser-Assisted Die Transfer
Proceedings paper2020, 70th IEEE Electronic Components and Technology Conference (ECTC), JUN 03-30, 2020, p.296-302