Browsing by Author "Travaly, Youssef"

300mm wafer thinning and backside passivation compatibility with temporary wafer bonding for 3D stacked IC applications

3D stacked IC demonstrator using hybrid collective die-to-wafer bonding with copper through silicon vias (TSV)

3D stacked ICs using Cu TSVs and die to wafer hybrid collective bonding

3D technology roadmap and status

3D wafer-level packaging die stacking using spin-on-dielectric polymer liner through-silicon vias

A high-reliable Cu/ULK integration scheme using Metal Hard Mask and Low-k capping film

A theoretical and experimental study of atomic-layer-deposited films onto porous dielectric substrates

Aggressive scaling of Cu lowk: impact on metrology

Air-gap formation by UV-assisted decomposition of CVD material

Air-gap formation by UV-assisted decomposition of CVD material

Atomic layer deposited barriers for copper interconnects

Bottom-up engineering of subnanometer copper diffusion barriers using NH2-derived self assembled monolayers

Challenges for structural stability of ultra-low-k based interconnects

Challenges in the implentation of low-k dielectrics in the back-end of line

Characterization and optimization of Cu-low k for 45nm and beyond

Characterization and optimization of porogen based PECVD deposited extreme low-k materials as a function of UV-cure time

Characterization of atomic layer deposited nanoscale structure on dense dielectric substrates by X-ray reflectivity

Characterization of PVD TaN and ALD WNxCy copper diffusion barriers on a porous CVD low-k material

Characterization of the growth of atomic layer deposited WNxCy films on various substrates

Cleaning requirement in the thinning module for 3D-Stacked IC (3D-SIC) integration