Browsing by Author "Zhang, Liping"
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Publication A novel low temperature etch approach to reduce ULK plasma damage
Meeting abstract2015, Plasma Etch and Strip in Microtechnology - PESM, 27/04/2015Publication Adsorption isobars of fluorocarbon compounds for cryogenic plasma etching of low-k dielectrics (in Russian)
Journal article2015, Electronic Engineering, 3, p.49Publication Adsorption isobars of fluorocarbon compounds selected for cryogenic etching of low-k materials
Meeting abstract2015, Spring MRS Meeting Symposium BB: Innovative Interconnects/Electrodes for Advances Devices, Flexible and Green Energy Electronics, 6/04/2015, p.BB2.03Publication Alternative integration of ultra low-k dielectrics by template replacement approach
Proceedings paper2015, IEEE International Interconnect Technology Conference - IITC / Materials for Advanced Metallization Conference - MAM, 18/05/2015, p.345-347Publication An experimental study of VUV plasma damage on porous organo-silicon glass materials
Meeting abstract2013-02, SPIE Advanced Lithography Conference: Advanced Etch Technology for Nanopatterning II, 24/02/2013Publication Applications of cryogenic plasma etching for microtechnology and advanced CMOS manufacturing
Meeting abstract2013, Plasma Etch and Strip in Microtechnology - PESM, 14/03/2013Publication Aspect ratio independent Plasma etching for silicon STI
Meeting abstract2019, 2019 Plasma Etch and Strip in Microelectronics - PESM, 20/05/2019Publication Challenges and approaches in advanced Fin patterning
Proceedings paper2019, PESM-2019 Plasma Etch and Strip in Microelectronics, 20/05/2019Publication Cryoetching of silicon and advanced materials for 3D interconnects
Meeting abstract2014, ECS Fall Meeting Symposium P5: Processing Materials of 3D Interconnects, Damascene, and Electronics Packaging 6, 5/10/2014, p.1689Publication Cryoetching processes applied to ULK material
Publication Cryogenic etching of porous organosilicate low-k materials: fluorine based plasma analysis
Meeting abstract2015, Plasma Etch and Strip in Microtechnology - PESM, 27/04/2015Publication Cryogenic etching of porous organosilicate low-k materials: reduction of plasma induced damage
Meeting abstract2015, AVS 62nd International Symposium & Exhibition, 19/10/2015, p.124Publication Cryogenic etching processes applied to porous low-k materials using C4F8/SF6 plasmas
Journal article2015, Journal of Physics D: Applied Physics, (48) 43, p.435202Publication Cryogenic etching reduces plasma-induced damage of ultralow-k dielectrics
Journal article2014, Solid State Technology, (57) 5Publication Cryogenic etching vs P4 approaches: paths towards ultra-low damage integration of mesoporous oxide dielectric materials
Meeting abstract2014, AVS 61st International Symposium and Exhibition, 9/11/2014, p.EM-TuM-6Publication Cu passivation for integration of gap-filling ultralow-k dielectrics
Journal article2016, Applied Physics Letters, (109) 23, p.232901Publication Damage free cryogenic etch of ultra low-k materials: recent experimental results and theoretical analysis
Proceedings paper2013, IEEE International Interconnect Technology Conference - IITC, 13/06/2013, p.51-53Publication Damage free cryogenic etching of a porous organosilica ultralow-k film
Journal article2013, Electrochemical and Solid-State Letters, (2) 2, p.N5-N7Publication Damage free cryogenic etching of porous organosilica ultralow-k film
Meeting abstract2012, AVS 59th Annual International Symposium and Exhibition, 28/10/2012Publication Damage free integration of ultralow-k dielectrics by template replacement approach
Journal article2015, Applied Physics Letters, (107) 2, p.92901