Browsing by author "Versluijs, Janko"
Now showing items 1-20 of 73
-
15nm half-pitch patterning: EUV + SELF-aligned double patterning
Versluijs, Janko; Souriau, Laurent; Hellin, David; Orain, Isabelle; Kimura, Yoshie; Kunnen, Eddy; Dekkers, Harold; Shi, Xiaoping; Albert, Johan; Wiaux, Vincent; Xu, Kaidong (2012) -
15nm HP patterning with EUV and SADP: key contributors for improvement of LWR, LER, and CDU
Xu, Kaidong; Souriau, Laurent; Hellin, David; Versluijs, Janko; Wong, Patrick; Vangoidsenhoven, Diziana; Vandenbroeck, Nadia; Dekkers, Harold; Shi, Xiaoping; Albert, Johan; Tan, Chi Lim; Vertommen, Johan; Coenegrachts, Bart; Orain, I.; Kimura, Y.; Wiaux, Vincent; Boullart, Werner (2013) -
15nm HP patterning with EUV lithography and SADP
Souriau, Laurent; Hellin, David; Kunnen, Eddy; Versluijs, Janko; Dekkers, Harold; Albert, Johan; Orain, Isabelle; Yoshie, Kimura; Xu, Kaidong; Vertommen, Johan; Wiaux, Vincent; Boullart, Werner (2012) -
21 nm Pitch dual-damascene BEOL process integration with full barrierless Ru metallization
Vega Gonzalez, Victor; Wilson, Chris; Paolillo, Sara; Decoster, Stefan; Mao, Ming; Versluijs, Janko; Blanco, Victor; Kesters, Els; Le, Quoc Toan; Lorant, Christophe; Varela Pedreira, Olalla; Lesniewska, Alicja; Heylen, Nancy; El-Mekki, Zaid; van der Veen, Marleen; Webers, Tomas; Vats, Hemant; Rynders, Luc; Cupak, Miroslav; Lee, Jae Uk; Drissi, Youssef; Halipre, Luc; Charley, Anne-Laure; Verdonck, Patrick; Witters, Thomas; Van Gompel, Sander; Kimura, Yosuke; Jourdan, Nicolas; Ciofi, Ivan; Contino, Antonino; Boccardi, Guillaume; Lariviere, Stephane; De Wachter, Bart; Vancoille, Eric; Lazzarino, Frederic; Ercken, Monique; Kim, Ryan Ryoung han; Trivkovic, Darko; Croes, Kristof; Leray, Philippe; Pardons, Katrien; Barla, Kathy; Tokei, Zsolt (2019) -
30-nm half-pitch metal patterning using MotifTM critical dimension shrink technique and double patterning
Versluijs, Janko; de Marneffe, Jean-Francois; Goossens, Danny; Vandeweyer, Tom; Wiaux, Vincent; Struyf, Herbert; Maenhoudt, Mireille; Brouri, Mohand; Vertommen, Johan; Kim, Ji Soo; Zhu, Helen; Sadjadi, Reza (2009) -
30nm half-pitch metal patterning using MotifTM CD shrink technique and double patterning
Versluijs, Janko; de Marneffe, Jean-Francois; Goossens, Danny; Op de Beeck, Maaike; Vandeweyer, Tom; Wiaux, Vincent; Struyf, Herbert; Maenhoudt, Mireille; Brouri, Mohand; Vertommen, Johan; Kim, Ji Soo; Zhu, Helen; Sadjadi, Reza (2008) -
A 0.314mm2 6T-SRAM cell built with tall triple-gate devices for 45nm node applications using 0.75NA 193nm lithography
Nackaerts, Axel; Ercken, Monique; Demuynck, Steven; Lauwers, Anne; Baerts, Christina; Bender, Hugo; Boullart, Werner; Collaert, Nadine; Degroote, Bart; Delvaux, Christie; de Marneffe, Jean-Francois; Dixit, Abhisek; De Meyer, Kristin; Hendrickx, Eric; Heylen, Nancy; Jaenen, Patrick; Laidler, David; Locorotondo, Sabrina; Maenhoudt, Mireille; Moelants, Myriam; Pollentier, Ivan; Ronse, Kurt; Rooyackers, Rita; Van Aelst, Joke; Vandenberghe, Geert; Vandervorst, Wilfried; Vandeweyer, Tom; Vanhaelemeersch, Serge; Van Hove, Marleen; Van Olmen, Jan; Verhaegen, Staf; Versluijs, Janko; Vrancken, Christa; Wiaux, Vincent; Jurczak, Gosia; Biesemans, Serge (2004-12) -
A novel plasma-assisted shrink process to enlarge process windows of narrow trenches and contacts for 45-nm node applications and beyond
Op de Beeck, Maaike; Versluijs, Janko; Tokei, Zsolt; Demuynck, Steven; de Marneffe, Jean-Francois; Boullart, Werner; Vanhaelemeersch, Serge; Zhu, Helen; Cirigliano, Peter; Pavel, Elisabeth; Sadjadi, Reza; Kim, Jisoo (2007) -
A way to integrate multiple block layers for middle of line contact patterning
Kunnen, Eddy; Demuynck, Steven; Brouri, Mohand; Boemmels, Juergen; Versluijs, Janko; Ryckaert, Julien (2015) -
Advanced optical lithography: double patterning options for 32 and 22nm node
Vandeweyer, Tom; Maenhoudt, Mireille; Vangoidsenhoven, Diziana; Gronheid, Roel; Versluijs, Janko; Miller, Andy; Bekaert, Joost; Truffert, Vincent; Wiaux, Vincent (2009) -
Alternative metal recess for fully-self-aligned-vias
Contino, Antonino; Le, Quoc Toan; Sakamoto, Kei; Schleicher, Filip; Paolillo, Sara; Pacco, Antoine; Kesters, Els; Lorant, Christophe; Murdoch, Gayle; Lariviere, Stephane; Vega Gonzalez, Victor; Versluijs, Janko; Jaenen, Patrick; Teugels, Lieve; van der Veen, Marleen; Jourdan, Nicolas; Ciofi, Ivan; Boccardi, Guillaume; Tokei, Zsolt; Wilson, Chris (2020) -
BEOL N2: M2 through SAxP process from MP21 to MP26: 193i SAQP vs EUV SADP
Hermans, Yannick; Wu, Chen; Buccheri, Nunzio; Schleicher, Filip; Versluijs, Janko; Montero Alvarez, Daniel; Dey, Bappaditya; Wong, Patrick; Rincon Delgadillo, Paulina; Park, Seongho; Tokei, Zsolt; Leray, Philippe; Halder, Sandip (2023-04-28) -
Challenges and opportunities of vertical FET devices using 3D circuit design layouts
Veloso, Anabela; Huynh Bao, Trong; Rosseel, Erik; Paraschiv, Vasile; Devriendt, Katia; Vecchio, Emma; Delvaux, Christie; Chan, BT; Ercken, Monique; Tao, Zheng; Li, Waikin; Altamirano Sanchez, Efrain; Versluijs, Janko; Brus, Stephan; Matagne, Philippe; Waldron, Niamh; Ryckaert, Julien; Mocuta, Dan; Collaert, Nadine (2016) -
Challenges in setting up the patterning processes for a 16nm node SRAM cell
Ercken, Monique; Vandeweyer, Tom; Versluijs, Janko; Truffert, Vincent; De Backer, Johan; Delvaux, Christie; Baerts, Christina (2010) -
CMOS 32nm technology node: business as usual for interconnect damascene patterning?
Beyer, Gerald; Ciofi, Ivan; Van Olmen, Jan; Carbonell, Laure; Versluijs, Janko; Wiaux, Vincent; Op de Beeck, Maaike; Maenhoudt, Mireille; Struyf, Herbert; Hendrickx, Dirk; de Marneffe, Jean-Francois; Vereecke, Guy; Claes, Martine; Bearda, Twan; Volders, Henny; Heylen, Nancy; Travaly, Youssef; Stucchi, Michele; Tokei, Zsolt; Cartuyvels, Rudi (2008-12) -
CMOS area scaling and the need for high aspect ratio vias
Briggs, Basoene; Guissi, Sofiane; Wilson, Chris; Ryckaert, Julien; Paolillo, Sara; Vandersmissen, Kevin; Versluijs, Janko; Lorant, Christophe; Heylen, Nancy; Boemmels, Juergen; Tokei, Zsolt; Sherazi, Yasser; Weckx, Pieter; Kljucar, Luka; van der Veen, Marleen; Boccardi, Guillaume; De Heyn, Vincent; Gupta, Anshul; Ervin, Joseph; Kamon, Matt (2018) -
Contact module at dense gate pitch technology challenges
Demuynck, Steven; Mao, Ming; Kunnen, Eddy; Versluijs, Janko; Croes, Kristof; Wu, Chen; Schaekers, Marc; Peter, Antony; Kauerauf, Thomas; Teugels, Lieve; Boemmels, Juergen (2014) -
Dielectric reliability of 50nm 1/2 pitch structures in Aurora® LK
Demuynck, Steven; Kim, Hongun; Huffman, Craig; Darnon, Maxime; Struyf, Herbert; Versluijs, Janko; Claes, Martine; Vereecke, Guy; Volders, Henny; Heylen, Nancy; Kellens, Kristof; Beyer, Gerald (2008) -
Dielectric reliability of 50nm half pitch structures in Aurora® LK
Demuynck, Steven; Kim, Honggun; Huffman, Craig; Darnon, Maxime; Struyf, Herbert; Versluijs, Janko; Claes, Martine; Vereecke, Guy; Verdonck, Patrick; Volders, Henny; Heylen, Nancy; Kellens, Kristof; De Roest, David; Sprey, Hessel; Beyer, Gerald (2009) -
Dielectric reliability of 70 nm pitch air-gap interconnect structures
Pantouvaki, Marianna; Sebaai, Farid; Kellens, Kristof; Goossens, Danny; Vereecke, Bart; Versluijs, Janko; Van Besien, Els; Caluwaerts, Rudy; Marrant, Koen; Bender, Hugo; Moussa, Alain; Struyf, Herbert; Beyer, Gerald (2011)