Browsing by author "Jourdan, Nicolas"

Now showing items 1-20 of 59

    • 12-EUV layer Surrounding Gate Transistor (SGT) for vertical 6-T SRAM: 5-nm-class technology for ultra-density logic devices 

      Kim, Min-Soo; Harada, N.; Kikuchi, Yoshiaki; Boemmels, Juergen; Mitard, Jerome; Huynh Bao, Trong; Matagne, Philippe; Tao, Zheng; Li, Waikin; Devriendt, Katia; Ragnarsson, Lars-Ake; Lorant, Christophe; Sebaai, Farid; Porret, Clément; Rosseel, Erik; Dangol, Anish; Batuk, Dmitry; Martinez Alanis, Gerardo Tadeo; Geypen, Jef; Jourdan, Nicolas; Sepulveda Marquez, Alfonso; Puliyalil, Harinarayanan; Jamieson, Geraldine; van der Veen, Marleen; Teugels, Lieve; El-Mekki, Zaid; Altamirano Sanchez, Efrain; Li, Y.; Nakamura, H.; Mocuta, Dan; Matsuoka, F. (2019)

    • 21 nm Pitch dual-damascene BEOL process integration with full barrierless Ru metallization 

      Vega Gonzalez, Victor; Wilson, Chris; Paolillo, Sara; Decoster, Stefan; Mao, Ming; Versluijs, Janko; Blanco, Victor; Kesters, Els; Le, Quoc Toan; Lorant, Christophe; Varela Pedreira, Olalla; Lesniewska, Alicja; Heylen, Nancy; El-Mekki, Zaid; van der Veen, Marleen; Webers, Tomas; Vats, Hemant; Rynders, Luc; Cupak, Miroslav; Lee, Jae Uk; Drissi, Youssef; Halipre, Luc; Charley, Anne-Laure; Verdonck, Patrick; Witters, Thomas; Van Gompel, Sander; Kimura, Yosuke; Jourdan, Nicolas; Ciofi, Ivan; Contino, Antonino; Boccardi, Guillaume; Lariviere, Stephane; De Wachter, Bart; Vancoille, Eric; Lazzarino, Frederic; Ercken, Monique; Kim, Ryan Ryoung han; Trivkovic, Darko; Croes, Kristof; Leray, Philippe; Pardons, Katrien; Barla, Kathy; Tokei, Zsolt (2019)

    • 300mm wafer level CVD-Mn/iodine-CVD-Cu-based metallization study for advanced copper interconnections 

      Jourdan, Nicolas; Cellier, Daniel; Van Elshocht, Sven; Boemmels, Juergen; Tokei, Zsolt (2016)

    • Alternative metal recess for fully-self-aligned-vias 

      Contino, Antonino; Le, Quoc Toan; Sakamoto, Kei; Schleicher, Filip; Paolillo, Sara; Pacco, Antoine; Kesters, Els; Lorant, Christophe; Murdoch, Gayle; Lariviere, Stephane; Vega Gonzalez, Victor; Versluijs, Janko; Jaenen, Patrick; Teugels, Lieve; van der Veen, Marleen; Jourdan, Nicolas; Ciofi, Ivan; Boccardi, Guillaume; Tokei, Zsolt; Wilson, Chris (2020)

    • Automated voids detection for metal filled trenches with bottom CD of 10nm 

      Hosseini, Maryam; Martinez Alanis, Gerardo Tadeo; van der Veen, Marleen; Jourdan, Nicolas; Dentoni Litta, Eugenio; Horiguchi, Naoto (2021)

    • Barrier/liner stacks for scaling the Cu interconnect metallization 

      van der Veen, Marleen; Jourdan, Nicolas; Vega Gonzalez, Victor; Wilson, Chris; Heylen, Nancy; Varela Pedreira, Olalla; Struyf, Herbert; Croes, Kristof; Boemmels, Juergen; Tokei, Zsolt (2016)

    • Buried Power Rail Integration for CMOS Scaling beyond the 3 nm Node 

      Gupta, Anshul; Tao, Zheng; Radisic, Dunja; Mertens, Hans; Varela Pedreira, Olalla; Demuynck, Steven; Boemmels, Juergen; Devriendt, Katia; Heylen, Nancy; Wang, Shouhua; Kenis, Karine; Teugels, Lieve; Sebaai, Farid; Lorant, Christophe; Jourdan, Nicolas; Chan, BT; Subramanian, Sujith; Schleicher, Filip; Peter, Antony; Rassoul, Nouredine; Siew, Yong Kong; Briggs, Basoene; Zhou, Daisy; Rosseel, Erik; Capogreco, Elena; Mannaert, Geert; Sepulveda Marquez, Alfonso; Dupuy, Emmanuel; Vandersmissen, Kevin; Chehab, Bilal; Murdoch, Gayle; Altamirano Sanchez, Efrain; Biesemans, Serge; Tokei, Zsolt; Dentoni Litta, Eugenio; Horiguchi, Naoto (2022)

    • Buried power rail integration with FinFETs for ultimate CMOS scaling 

      Gupta, Anshul; Varela Pedreira, Olalla; Arutchelvan, Goutham; Zahedmanesh, Houman; Devriendt, Katia; Hanssen, Frederik; Tao, Zheng; Ritzenthaler, Romain; Wang, Shouhua; Radisic, Dunja; Kenis, Karine; Teugels, Lieve; Sebaai, Farid; Lorant, Christophe; Jourdan, Nicolas; Chan, BT; Subramanian, Sujith; Schleicher, Filip; Hopf, Toby; Peter, Antony; Rassoul, Nouredine; Debruyn, Haroen; Demonie, Ingrid; Siew, Yong Kong; Chiarella, Thomas; Briggs, Basoene; Zhou, Daisy; Rosseel, Erik; De Keersgieter, An; Capogreco, Elena; Dentoni Litta, Eugenio; Boccardi, Guillaume; Baudot, Sylvain; Mannaert, Geert; Bontemps, Noemie; Sepulveda Marquez, Alfonso; Mertens, Sofie; Kim, Min-Soo; Dupuy, Emmanuel; Vandersmissen, Kevin; Paolillo, Sara; Cousserier, Joris; Yakimets, Dmitry; Lazzarino, Frederic; Chehab, Bilal; Favia, Paola; Drijbooms, Chris; Jaysankar, Manoj; Morin, Pierre; Altamirano Sanchez, Efrain; Mitard, Jerome; Wilson, Chris; Holsteyns, Frank; Boemmels, Juergen; Demuynck, Steven; Tokei, Zsolt; Horiguchi, Naoto (2020)

    • Buried Power Rail Integration with Si FinFETs for CMOS Scaling beyond the 5 nm Node 

      Gupta, Anshul; Mertens, Hans; Tao, Zheng; Demuynck, Steven; Boemmels, Juergen; Arutchelvan, Goutham; Devriendt, Katia; Varela Pedreira, Olalla; Ritzenthaler, Romain; Wang, Shouhua; Radisic, Dunja; Kenis, Karine; Teugels, Lieve; Sebaai, Farid; Lorant, Christophe; Jourdan, Nicolas; Chan, BT; Zahedmanesh, Houman; Subramanian, Sujith; Schleicher, Filip; Hopf, Toby; Peter, Antony; Rassoul, Nouredine; Debruyn, Haroen; Demonie, Ingrid; Siew, Yong Kong; Chiarella, Thomas; Briggs, Basoene; Zhou, Daisy; Rosseel, Erik; De Keersgieter, An; Capogreco, Elena; Dentoni Litta, Eugenio; Boccardi, Guillaume; Baudot, Sylvain; Mannaert, Geert; Bontemps, N.; Sepulveda Marquez, Alfonso; Mertens, Sofie; Kim, Min Soo; Dupuy, Emmanuel; Vandersmissen, Kevin; Paolillo, Sara; Yakimets, Dmitry; Chehab, Bilal; Favia, Paola; Drijbooms, Chris; Cousserier, Joris; Jaysankar, Manoj; Lazzarino, Frederic; Morin, Pierre; Altamirano Sanchez, Efrain; Mitard, Jerome; Wilson, Chris; Holsteyns, Frank; Tokei, Zsolt; Horiguchi, Naoto (2020)

    • Buried Power Rail Metal exploration towards the 1 nm Node 

      Gupta, Anshul; Radisic, Dunja; Maes, J.W.; Varela Pedreira, Olalla; Soulie, Jean-Philippe; Jourdan, Nicolas; Mertens, Hans; Bandyopadhyay, Sudip; Le, Quoc Toan; Pacco, Antoine; Heylen, Nancy; Vandersmissen, Kevin; Devriendt, Katia; Zhu, C.; Datta, S.; Sebaai, Farid; Wang, S.; Mousa, M.; Lee, J.; Geypen, Jef; De Wachter, Bart; Chehab, Bilal; Salahuddin, Shairfe Muhammad; Murdoch, Gayle; Biesemans, Serge; Tokei, Zsolt; Dentoni Litta, Eugenio; Horiguchi, Naoto (2021)

    • Buried Power Rail Scaling and Metal Assessment for the 3 nm Node and Beyond 

      Gupta, Anshul; Varela Pedreira, Olalla; Tao, Zheng; Mertens, Hans; Radisic, Dunja; Jourdan, Nicolas; Devriendt, Katia; Heylen, Nancy; Wang, Shouhua; Chehab, Bilal; Jang, Doyoung; Hellings, Geert; Sebaai, Farid; Lorant, Christophe; Teugels, Lieve; Peter, Antony; Chan, BT; Schleicher, Filip; Demonie, Ingrid; Marien, Philippe; Sepulveda Marquez, Alfonso; Richard, Olivier; Nagesh, Nishanth; Lesniewska, Alicja; Lazzarino, Frederic; Ryckaert, Julien; Morin, Pierre; Altamirano Sanchez, Efrain; Murdoch, Gayle; Boemmels, Juergen; Demuynck, Steven; Na, Myung Hee; Tokei, Zsolt; Biesemans, Serge; Dentoni Litta, Eugenio; Horiguchi, Naoto (2020)

    • Co and Ru dual damascene compatible metallization studies 

      van der Veen, Marleen; Heylen, Nancy; Lariviere, Stephane; Vega Gonzalez, Victor; Kesters, Els; Le, Quoc Toan; Teugels, Lieve; Chew, Soon Aik; Philipsen, Harold; Hung, Joey; Adelmann, Christoph; Vanstreels, Kris; Jourdan, Nicolas; Holsteyns, Frank; Struyf, Herbert; Wilson, Chris; Tokei, Zsolt (2019)

    • Cobalt and Ruthenium drift in ultra-thin oxides 

      Tierno, Davide; Varela Pedreira, Olalla; Wu, Chen; Jourdan, Nicolas; Kljucar, Luka; Tokei, Zsolt; Croes, Kristof (2019)

    • Copper-ruthenium system study for advanced hybrid BEOL -interconnects applications 

      Jourdan, Nicolas; Korytov, Maxim; Van Elshocht, Sven; Tokei, Zsolt (2019)

    • Cu resistivity and intrinsic EM-reliability study in Ta/Cu, Co/Cu and Ru/Cu systems for advanced BEOL Cu interconnections 

      Jourdan, Nicolas; Varela Pedreira, Olalla; van der Veen, Marleen; Adelmann, Christoph; Van Elshocht, Sven; Tokei, Zsolt (2018)

    • Cu wire resistance improvement using Mn-based self-formed barriers 

      Siew, Yong Kong; Jourdan, Nicolas; Ciofi, Ivan; Croes, Kristof; Wilson, Chris; Tang, Baojun; Demuynck, Steven; Ai, Huang; Cellier, Daniel; Cockburn, Andrew; Boemmels, Juergen; Tokei, Zsolt (2014)

    • CVD Mn-based barrier for advanced copper interconnect technology: integration study 

      Jourdan, Nicolas (2014)

    • CVD Mn-based self-formed barrier for advanced interconnect technology 

      Siew, Yong Kong; Jourdan, Nicolas; Barbarin, Yohan; Machillot, Jerome; Demuynck, Steven; Croes, Kristof; Tseng, J.; Ai, Hua; Tang, Jing; Naik, M.; Wang, P.; Narasimhan, M.; Abraham, M.; Cockburn, Andrew; Boemmels, Juergen; Tokei, Zsolt (2013)

    • CVD-Mn(Nx) as copper diffusion barrier for advanced interconnect technologies 

      Jourdan, Nicolas; Machillot, Jerome; Barbarin, Yohan; Siew, Yong Kong; Ai, Hua; Cockburn, Andrew; Nguyen, Mai Phuong; Van Elshocht, Sven; Boemmels, Juergen; Lakshmanan, A.; Ma, Paul; Narasimhan, Murali; Tokei, Zsolt (2013)

    • CVD-Mn/CVD-Ru-based barrier/liner solution for advanced BEOL Cu/low-k interconnects 

      Jourdan, Nicolas; van der Veen, Marleen; Vega Gonzalez, Victor; Croes, Kristof; Lesniewska, Alicja; Varela Pedreira, Olalla; Van Elshocht, Sven; Boemmels, Juergen; Tokei, Zsolt (2016)