Now showing items 1-20 of 20

    • 21 nm Pitch dual-damascene BEOL process integration with full barrierless Ru metallization 

      Vega Gonzalez, Victor; Wilson, Chris; Paolillo, Sara; Decoster, Stefan; Mao, Ming; Versluijs, Janko; Blanco, Victor; Kesters, Els; Le, Quoc Toan; Lorant, Christophe; Varela Pedreira, Olalla; Lesniewska, Alicja; Heylen, Nancy; El-Mekki, Zaid; van der Veen, Marleen; Webers, Tomas; Vats, Hemant; Rynders, Luc; Cupak, Miroslav; Lee, Jae Uk; Drissi, Youssef; Halipre, Luc; Charley, Anne-Laure; Verdonck, Patrick; Witters, Thomas; Van Gompel, Sander; Kimura, Yosuke; Jourdan, Nicolas; Ciofi, Ivan; Contino, Antonino; Boccardi, Guillaume; Lariviere, Stephane; De Wachter, Bart; Vancoille, Eric; Lazzarino, Frederic; Ercken, Monique; Kim, Ryan Ryoung han; Trivkovic, Darko; Croes, Kristof; Leray, Philippe; Pardons, Katrien; Barla, Kathy; Tokei, Zsolt (2019)
    • Alternative metal recess for fully-self-aligned-vias 

      Contino, Antonino; Le, Quoc Toan; Sakamoto, Kei; Schleicher, Filip; Paolillo, Sara; Pacco, Antoine; Kesters, Els; Lorant, Christophe; Murdoch, Gayle; Lariviere, Stephane; Vega Gonzalez, Victor; Versluijs, Janko; Jaenen, Patrick; Teugels, Lieve; van der Veen, Marleen; Jourdan, Nicolas; Ciofi, Ivan; Boccardi, Guillaume; Tokei, Zsolt; Wilson, Chris (2020)
    • Co and Ru dual damascene compatible metallization studies 

      van der Veen, Marleen; Heylen, Nancy; Lariviere, Stephane; Vega Gonzalez, Victor; Kesters, Els; Le, Quoc Toan; Teugels, Lieve; Chew, Soon Aik; Philipsen, Harold; Hung, Joey; Adelmann, Christoph; Vanstreels, Kris; Jourdan, Nicolas; Holsteyns, Frank; Struyf, Herbert; Wilson, Chris; Tokei, Zsolt (2019)
    • Co-optimization of lithographic and patterning processes for improved EPE performance 

      Maslow, Mark; Timoshkov, Vadim; Kiers, Ton; Jee, Tae Kwon; de Loijer, Peter; Morikita, Shinya; Demand, Mark; Metz, Andrew W; Okada, Soichiro; Kumar, Kaushik A.; Biesemans, Serge; Yaegashi, Hidetami; Di Lorenzo, Paolo; Bekaert, Joost; Mao, Ming; Beral, Christophe; Lariviere, Stephane (2017)
    • Design and pitch scaling for affordable node transition and EUV insertion scenario 

      Kim, Ryan Ryoung han; Ryckaert, Julien; Raghavan, Praveen; Sherazi, Yasser; Debacker, Peter; Trivkovic, Darko; Gillijns, Werner; Tan, Ling Ee; Drissi, Youssef; Blanco, Victor; Bekaert, Joost; Mao, Ming; Lariviere, Stephane; McIntyre, Greg (2017)
    • Electrical comparison of iN7 EUV hybrid and EUV single patterning BEOL metal layers 

      Lariviere, Stephane; Wilson, Chris; Kutrzeba Kotowska, Bogumila; Versluijs, Janko; Decoster, Stefan; Mao, Ming; van der Veen, Marleen; Jourdan, Nicolas; El-Mekki, Zaid; Heylen, Nancy; Kesters, Els; Verdonck, Patrick; Beral, Christophe; Van Den Heuvel, Dieter; De Bisschop, Peter; Bekaert, Joost; Blanco, Victor; Ciofi, Ivan; Wan, Danny; Briggs, Basoene; Mallik, Arindam; Hendrickx, Eric; Kim, Ryan Ryoung han; McIntyre, Greg; Ronse, Kurt; Boemmels, Juergen; Tokei, Zsolt; Mocuta, Dan (2018)
    • EUV single patterning for logic metal layers: achievement and challenge 

      Kim, Ryan Ryoung han; Gillijns, Werner; Drissi, Youssef; Trivkovic, Darko; Blanco, Victor; Lariviere, Stephane; De Ruyter, Rudi; Dehan, Morin; McIntyre, Greg; Tan, Ling Ee (2017)
    • Exploring W-Cu hybrid dual damascene metallization for future nodes 

      Lei, W.; Pethe, S.; Hwang, S.; Chen, F.; Wu, Z.; Machillot, J.; Cockburn, A.; Jansen, A.; van der Veen, Marleen; Varela Pedreira, Olalla; Heylen, Nancy; Jourdan, Nicolas; Lariviere, Stephane; Park, Seongho; Struyf, Herbert; Tokei, Zsolt (2021)
    • Hybrid Metallization with Cu in sub 30nm Interconnects 

      van der Veen, Marleen; Soethoudt, Job; Delabie, Annelies; Varela Pedreira, Olalla; Vega Gonzalez, Victor; Lariviere, Stephane; Teugels, Lieve; Jourdan, Nicolas; Decoster, Stefan; Struyf, Herbert; Wilson, Chris; Croes, Kristof; Tokei, Zsolt (2020)
    • Large area EUV via yield analysis for single damascene process: voltage contrast, CD and defect metrology 

      Blanco, Victor; Paolillo, Sara; van der Veen, Marleen; Lariviere, Stephane; Lorusso, Gian; De Poortere, Etienne; Tabery, Cyrus; Qiao, Fu; Lai, Shu-yu; Kea, Marc; Wang, Luke; Su, Yu Chi; Oh, Joe; Huang, Jim; Chen, Jimmy; Huang, Jonathan (2019)
    • Metal reliability mechanisms in Ruthenium interconnects 

      Varela Pedreira, Olalla; Stucchi, Michele; Gupta, Anshul; Vega Gonzalez, Victor; van der Veen, Marleen; Lariviere, Stephane; Wilson, Chris; Tokei, Zsolt; Croes, Kristof (2020)
    • N5 BEOL process options patterning flows comparing 193immersion to hybrid EUV or full EUV 

      Lariviere, Stephane; Briggs, Basoene; Wilson, Chris; Mallik, Arindam; Decoster, Stefan; Wan, Danny; Bekaert, Joost; Blanco, Victor; Mao, Ming; Paolillo, Sara; Kutrzeba Kotowska, Bogumila; Versluijs, Janko; Boemmels, Juergen; Trivkovic, Darko; Tokei, Zsolt; McIntyre, Greg; Mocuta, Dan (2017)
    • N5 technology node dual-damascene interconnects enabled using multi patterning 

      Briggs, Basoene; Wilson, Chris; Devriendt, Katia; van der Veen, Marleen; Decoster, Stefan; Paolillo, Sara; Versluijs, Janko; Kesters, Els; Sebaai, Farid; Jourdan, Nicolas; El-Mekki, Zaid; Heylen, Nancy; Verdonck, Patrick; Wan, Danny; Varela Pedreira, Olalla; Croes, Kristof; Dutta, Shibesh; Ryckaert, Julien; Mallik, Arindam; Lariviere, Stephane; Boemmels, Juergen; Tokei, Zsolt (2017)
    • Patterning of Ru metal lines at 18 nm pitch 

      Decoster, Stefan; Kundu, Souvik; Lazzarino, Frederic; Lariviere, Stephane; O'Toole, Martin; Murdoch, Gayle; van der Veen, Marleen; Heylen, Nancy; Le, Quoc Toan (2022)
    • SAQP and EUV block patterning of BEOL metal layers on IMEC's iN7 platform 

      Bekaert, Joost; Di Lorenzo, Paolo; Mao, Ming; Decoster, Stefan; Lariviere, Stephane; Franke, Joern-Holger; Blanco, Victor; Kutrzeba Kotowska, Bogumila; Lazzarino, Frederic; Gallagher, Emily; Hendrickx, Eric; Leray, Philippe; Kim, Ryan Ryoung han; McIntyre, Greg; Colsters, Paul; Wittebrood, Friso; van Dijk, Joep; Maslow, Mark; Timoshkov, Vadim; Kiers, Ton (2017)
    • Scaled TaN barriers for Cu interconnects: reliability performance 

      Varela Pedreira, Olalla; Lesniewska, Alicja; Jourdan, Nicolas; Vega Gonzalez, Victor; Lariviere, Stephane; van der Veen, Marleen; Croes, Kristof; Tokei, Zsolt (2019)
    • Single exposure EUV patterning for BEOL metal layers on the imec iN7 platform 

      Blanco, Victor; Bekaert, Joost; Mao, Ming; Kutrzeba Kotowska, Bogumila; Lariviere, Stephane; Ciofi, Ivan; Baert, Rogier; Kim, Ryan Ryoung han; Gallagher, Emily; Hendrickx, Eric; Tan, Ling Ee; Gillijns, Werner; Trivkovic, Darko; Leray, Philippe; Halder, Sandip; Gallagher, Matt; Lazzarino, Frederic; Paolillo, Sara; Wan, Danny; Mallik, Arindam; Sherazi, Yasser; McIntyre, Greg; Dusa, Mircea; Rusu, Paul; Hollink, Thijs; Fliervoet, Timon; Wittebrood, Friso (2017)
    • The imec iN7 EUV platform: M2-Block and Via patterning developments 

      Bekaert, Joost; Franke, Joern-Holger; Mao, Ming; Lariviere, Stephane; Decoster, Stefan; Di Lorenzo, Paolo; Kutrzeba Kotowska, Bogumila; Blanco, Victor; Hendrickx, Eric; Gallagher, Emily; Leray, Philippe; Kim, Ryan Ryoung han; McIntyre, Greg; Colsters, Paul; Wittebrood, Friso; van Dijk, Joep; Timoshkov, Vadim; Kiers, Ton; Maslow, Mark (2016)
    • Three-layer BEOL process integration with supervia and self-aligned-block options for the 3nm node 

      Vega Gonzalez, Victor; Wilson, Chris; Briggs, Basoene; Decoster, Stefan; Versluijs, Janko; Lesniewska, Alicja; Paolillo, Sara; Baert, Rogier; Puliyalil, Harinarayanan; Bekaert, Joost; Kesters, Els; Le, Quoc Toan; Lorant, Christophe; Varela Pedreira, Olalla; Teugels, Lieve; Heylen, Nancy; El-Mekki, Zaid; van der Veen, Marleen; Webers, Tomas; Vats, Hemant; Rynders, Luc; Cupak, Miroslav; Lee, Jae Uk; Drissi, Youssef; Halipre, Luc; Charley, Anne-Laure; Verdonck, Patrick; Witters, Thomas; Van Gompel, Sander; Kimura, Yosuke; Jourdan, Nicolas; Ciofi, Ivan; Gupta, Anshul; Contino, Antonino; Boccardi, Guillaume; Lariviere, Stephane; Dupas, Luc; De Wachter, Bart; Vancoille, Eric; Lazzarino, Frederic; Ercken, Monique; Debacker, Peter; Kim, Ryan Ryoung han; Trivkovic, Darko; Croes, Kristof; Leray, Philippe; Dillemans, Leander; Chen, Yi-Fan; Tokei, Zsolt (2019)
    • UV nanosecond laser annealing for Ru interconnects 

      Jourdan, Nicolas; Roze, Fabien; Tabata, Toshiyuki; Lariviere, Stephane; Contino, Antonino; Mazzamuto, Fulvio; Tokei, Zsolt (2020)