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Browsing by Author "Ikota, Masami"

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    3D measurement of 3D NAND memory hole with CD-SEM and tilted FIB

    Ohashi, Takeyoshi
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    Yamaguchi, Atsuko
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    Hasumi, Kazuhisa
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    Ikota, Masami
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    Tan, Chi Lim
    Proceedings paper
    2017, 43rd International Conference on Micro and Nanoengineering - MNE, 18/09/2017, p.OC073
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    Contact inspection and resistance - capacitance measurement of Si nanowire with SEM voltage contrast

    Ohashi, Takeyoshi
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    Hasumi, Kazuhisa
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    Ikota, Masami
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    Lorusso, Gian  
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    Mertens, Hans  
    Journal article
    2019, Journal of Micro/Nanolithography MEMS and MOEMS, (18) 2, p.21205
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    Contact inspection of Si nanowire with SEM voltage contrast

    Ohashi, Takeyoshi
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    Yamaguchi, Atsuko
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    Hasumi, Kazuhisa
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    Ikota, Masami
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    Lorusso, Gian  
    Proceedings paper
    2018, Metrology, Inspection, and Process Control for Microlithography XXXII, 25/02/2018, p.105850B
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    e-beam metrology of thin resist for high NA EUVL

    Lorusso, Gian  
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    De Simone, Danilo  
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    Zidan, Mohamed  
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    Severi, Joren  
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    Moussa, Alain  
    ;
    Dey, Bappaditya  
    Journal article review
    2023, JAPANESE JOURNAL OF APPLIED PHYSICS, (62) SG, p.Art. SG0808
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    EB metrology of Ge channel gate-all-around FET: buckling evaluation and EB damage assessment

    Ohashi, Takeyoshi
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    Hasumi, Kazuhisa
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    Ikota, Masami
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    Lorusso, Gian  
    ;
    Witters, Liesbeth  
    Proceedings paper
    2020, Metrology, Inspection, and Process Control for Microlithography XXXIV, 23/02/2020, p.1132525
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    Electron beam metrology for advanced technology nodes

    Lorusso, Gian  
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    Horiguchi, Naoto  
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    Boemmels, Juergen  
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    Wilson, Chris  
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    Van den Bosch, Geert  
    Journal article
    2019, Japanese Journal of Applied Physics, (58) SD, p.SD0801
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    Enabling CD SEM metrology for 5nm technology node and beyond

    Lorusso, Gian  
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    Ohashi, Takeyoshi
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    Yamaguchi, Astuko
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    Inoue, Osamu
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    Sutani, Takumichi
    Proceedings paper
    2017, Metrology, Inspection, and Process Control for Microlithography XXXI, 26/02/2017, p.1014512
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    Impact of annealing temperature on DSA process: toward faster assembly kinetics

    Suh, Hyo Seon  
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    Nair, Vineet Vijayakrishnan  
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    Rincon Delgadillo, Paulina  
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    Doise, Jan  
    Proceedings paper
    2018, Advances in Patterning Materials and Processes XXXV, 24/02/2018, p.105860T
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    Linewidth and roughness measurement of SAOP by using FIB and planer-TEM as reference metrology

    Takamasu, Kiyoshi
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    Takahashi, Satoru
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    Kawada, Hiroki
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    Ikota, Masami
    ;
    Decoster, Stefan  
    Proceedings paper
    2019, Metrology, Inspection, and Process Control for Microlithography XXXIII, 24/02/2019, p.109590Q
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    Metrology of Thin Resist for High NA EUVL

    Lorusso, Gian  
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    Beral, Christophe  
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    Bogdanowicz, Janusz  
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    De Simone, Danilo  
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    Hasan, Mahmudul  
    Proceedings paper
    2022, Conference on Metrology, Inspection, and Process Control XXXVI Part of SPIE Advanced Lithography and Patterning Conference, FEB 24-MAY 27, 2022, p.12053OO
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    Need for LWR metrology standardization: the imec roughness protocol

    Lorusso, Gian  
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    Sutani, Takeyoshi
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    Rutigliani, Vito
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    Van Roey, Frieda  
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    Moussa, Alan
    Journal article
    2018, Journal of Micro/Nanolithography MEMS and MOEMS, 17, p.41009
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    Precise measurement of thin film thickness in 3D-NAND device with CD-SEM

    Ohashi, Takeyoshi
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    Atsuko, Yamaguchi
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    Kobayashi, Takashi
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    Inoue, Osamu
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    Hasumi, Kazuhisa
    Oral presentation
    2016, 42nd Micro and Nano Engineering Conference
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    Precise measurement of thin-film thickness in 3D-NAND device with CD-SEM

    Ohashi, Takeyoshi
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    Yamaguchi, Atsuko
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    Hasumi, Kazuhisa
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    Ikota, Masami
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    Lorusso, Gian  
    Journal article
    2018, Journal of Micro/Nanolithography MEMS and MOEMS, (17) 2, p.24002
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    Regularized Autoencoder for The Analysis of Multivariate Metrology Data

    Saib, Mohamed  
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    Lorusso, Gian  
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    Charley, Anne-Laure  
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    Leray, Philippe  
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    Kondo, Tsuyoshi
    Proceedings paper
    2022, Conference on Metrology, Inspection, and Process Control XXXVI Part of SPIE Advanced Lithography and Patterning Conference, FEB 24-MAY 27, 2022, p.Art. 120530V
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    The need for LWR metrology standardization: the imec roughness protocol

    Lorusso, Gian  
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    Sutani, Takeyoshi
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    Rutigliani, Vito
    ;
    Van Roey, Frieda  
    ;
    Moussa, Alain  
    Proceedings paper
    2018, Metrology, Inspection, and Process Control for Microlithography XXXII, 25/02/2018, p.105850D
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    Variability study with CD-SEM metrology for STT-MRAM: correlation analysis between physical dimensions and electrical property of the memory element

    Ohashi, Takeyoshi
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    Yamaguchi, Atsuko
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    Hasumi, Kazuhisa
    ;
    Inoue, Osamu
    ;
    Ikota, Masami
    Proceedings paper
    2017, Metrology, Inspection, and Process Control for Microlithography XXXI, 26/02/2017, p.101450H

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