Browsing by Author "Kim, Soon-Wook"
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Publication 3D Wafer-to-Wafer Bonding Thermal Resistance Comparison: Hybrid Cu/dielectric Bonding versus Dielectric via-last Bonding
; ; ; ; Publication 3D-optimized SRAM Macro Design and Application to Memory-on-Logic 3D-IC at Advanced Nodes
Proceedings paper2020, IEEE International Electron Devices Meeting (IEDM), DEC 12-18, 2020Publication 3D-SoC integration utilizing high accuracy wafer level bonding
Proceedings paper2016, IEEE 18th Electronics Packaging Technology Conference - EPTC, 30/11/2016, p.111-114Publication Advances in SiCN-SiCN bonding with high accuracy wafer-to-wafer (W2W) stacking technology
Proceedings paper2018, IEEE International Interconnect Technology Conference - IITC, 4/06/2018, p.985-992Publication Area-Selective Electroless Deposition of Cu for Hybrid Bonding
Journal article2021, IEEE ELECTRON DEVICE LETTERS, (42) 12, p.1826-1829Publication Characterization and benchmarking of the low inter-tier thermal resistance of 3D hybrid Cu/dielectric wafer-to-wafer bonding
Journal article2017-03, Journal of Electronic Packaging, (139) 1, p.11008-011008-9Publication Characterization of bonding activation sequences to enable ultra-low Cu/SiCN wafer level hybrid bonding
Publication Characterization of inorganic dielectric layers for low thermal budget wafer to wafer bonding
Proceedings paper2017, 5th International Workshop on Low Temperature Bonding for 3D Integration - LTB-3D, 16/05/2017, p.24Publication Detection of local Cu-to-Cu bonding defects in wafer-to-wafer hybrid bonding using GHz-SAM.
Proceedings paper2018-11, International Symposium for Testing and Failure Analysis - ISTFA, 28/10/2018, p.8-11Publication Development of multi-stack dielectric wafer bonding
Proceedings paper2016, 17th International Conference on Electronic Packaging Technology - ICEPT, 16/08/2016, p.22-25Publication Direct bonding of low temperature heterogeneous dielectrics
; ; ; ; ; Proceedings paper2019, 69th IEEE Electronic Components and Technology Conference (ECTC), MAY 29-31, 2019, p.2206-2212Publication Electromigration behavior of 2μm sub-micron Cu/SiCN hybrid bonds
; ; ; ; ; Proceedings paper2019, IEEE International Interconnect Technology Conference (IITC 2019) and Materials for Advanced Metallization Conference (MAM 2019), 3/06/2019, p.8.4Publication Electromigration behavior of Cu/SiCN to Cu/SiCN hybrid bonds for 3D integrated circuits
; ; ; ; ; Proceedings paper2018, International Conference on Solid State Devices and Materials - SSDM, 11/09/2018, p.449-450Publication Fault isolation of resistive/open 3D wafer bonding interconnects by thermal laser stimulation and light-induced capacitance alteration
Proceedings paper2020, International Symposium for Testing and Failure Analysis (ISTFA2020), 7/12/2020Publication In-line atomic resolution local nanotopography variation metrology for CMP process
; ; ; Publication In-line metrology for atomic resolution local height variation
Proceedings paper2017, 28th Annual SEMI Advanced Semiconductor Manufacturing Conference - ASMC, 15/05/2017, p.267-272Publication Inductive links for 3D stacked chip-to-chip communication
Proceedings paper2019, 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 28/05/2019, p.1215-1220Publication Investigation of Paramagnetic Defects in SiCN and SiCO-based Wafer Bonding
Proceedings paper2020, 22nd IEEE Electronics Packaging Technology Conference (EPTC), DEC 02-29, 2020, p.464-467Publication Nanotopography control for wafer-to-wafer hybrid bonding by CMP
Meeting abstract2017, International Conference on Planarization / CMP Technology - ICPT 2017, 11/10/2017Publication Novel Cu/SiCN surface topography control for 1 mu m pitch hybrid wafer-to-wafer bonding
Proceedings paper2020, 70th IEEE Electronic Components and Technology Conference (ECTC), JUN 03-30, 2020, p.216-222