Browsing by author "El-Mekki, Zaid"
Now showing items 1-20 of 37
-
12-EUV layer Surrounding Gate Transistor (SGT) for vertical 6-T SRAM: 5-nm-class technology for ultra-density logic devices
Kim, Min-Soo; Harada, N.; Kikuchi, Yoshiaki; Boemmels, Juergen; Mitard, Jerome; Huynh Bao, Trong; Matagne, Philippe; Tao, Zheng; Li, Waikin; Devriendt, Katia; Ragnarsson, Lars-Ake; Lorant, Christophe; Sebaai, Farid; Porret, Clément; Rosseel, Erik; Dangol, Anish; Batuk, Dmitry; Martinez Alanis, Gerardo Tadeo; Geypen, Jef; Jourdan, Nicolas; Sepulveda Marquez, Alfonso; Puliyalil, Harinarayanan; Jamieson, Geraldine; van der Veen, Marleen; Teugels, Lieve; El-Mekki, Zaid; Altamirano Sanchez, Efrain; Li, Y.; Nakamura, H.; Mocuta, Dan; Matsuoka, F. (2019) -
21 nm Pitch dual-damascene BEOL process integration with full barrierless Ru metallization
Vega Gonzalez, Victor; Wilson, Chris; Paolillo, Sara; Decoster, Stefan; Mao, Ming; Versluijs, Janko; Blanco, Victor; Kesters, Els; Le, Quoc Toan; Lorant, Christophe; Varela Pedreira, Olalla; Lesniewska, Alicja; Heylen, Nancy; El-Mekki, Zaid; van der Veen, Marleen; Webers, Tomas; Vats, Hemant; Rynders, Luc; Cupak, Miroslav; Lee, Jae Uk; Drissi, Youssef; Halipre, Luc; Charley, Anne-Laure; Verdonck, Patrick; Witters, Thomas; Van Gompel, Sander; Kimura, Yosuke; Jourdan, Nicolas; Ciofi, Ivan; Contino, Antonino; Boccardi, Guillaume; Lariviere, Stephane; De Wachter, Bart; Vancoille, Eric; Lazzarino, Frederic; Ercken, Monique; Kim, Ryan Ryoung han; Trivkovic, Darko; Croes, Kristof; Leray, Philippe; Pardons, Katrien; Barla, Kathy; Tokei, Zsolt (2019) -
A highly reliable 1.4μm pitch via-last TSV module for wafer-to-wafer hybrid bonded 3D-SOC systems
Van Huylenbroeck, Stefaan; De Vos, Joeri; El-Mekki, Zaid; Jamieson, Geraldine; Tutunjyan, Nina; Muga, Karthik; Stucchi, Michele; Miller, Andy; Beyer, Gerald; Beyne, Eric (2019) -
Area-Selective Electroless Deposition of Cu for Hybrid Bonding
Inoue, Fumihiro; Iacovo, Serena; El-Mekki, Zaid; Kim, Soon-Wook; Struyf, Herbert; Beyne, Eric (2021) -
Copper plating for 3D interconnects
Radisic, Alex; Luhn, Ole; Philipsen, Harold; El-Mekki, Zaid; Honore, Mia; Rodet, Simon; Armini, Silvia; Drijbooms, Chris; Bender, Hugo; Ruythooren, Wouter (2011) -
Copper plating for 3D interconnects
Radisic, Alex; Luhn, Ole; Vaes, Jan; Armini, Silvia; El-Mekki, Zaid; Radisic, Dunja; Ruythooren, Wouter; Vereecken, Philippe (2009) -
Copper plating for 3d interconnects
Radisic, Alex; Luhn, Ole; Vaes, Jan; Armini, Silvia; El-Mekki, Zaid; Radisic, Dunja; Ruythooren, Wouter; Vereecken, Philippe (2010) -
Copper plating on resistive substrates, diffusion barrier and alternative seed layers
Radisic, Alex; Nagar, Magi; Strubbe, Katrien; Armini, Silvia; El-Mekki, Zaid; Volders, Henny; Ruythooren, Wouter; Vereecken, Philippe (2009) -
Copper plating on resistive substrates, diffusion barrier and alternative seed layers
Radisic, Alex; Nagar, Magi; Strubbe, K.; Armini, Silvia; El-Mekki, Zaid; Volders, Henny; Ruythooren, Wouter; Vereecken, Philippe (2010) -
Development of a new metallization scheme for making nanoscale interconnects based on plasma-functionalization and electroless deposition
Dictus, Dries; Dordi, Y.; Gurer, E.; Krishtab, Mikhail; Baklanov, Mikhaïl; Carbonell, Laure; van der Veen, Marleen; El-Mekki, Zaid; Tokei, Zsolt (2013) -
Direct copper electrochemical deposition on Ru-based substrates for advanced interconnects target 30 nm and ½ pitch lines: from coupon to full-wafer experiments
Armini, Silvia; Demuynck, Steven; El-Mekki, Zaid; Swerts, Johan; Nagar, Magi; Radisic, Alex; Heylen, Nancy; Beyer, Gerald; Leunissen, Peter; Vereecken, Philippe (2011-05) -
Direct copper electrochemical deposition on Ru-based substrates for advanced interconnects target 30 nm and ½ pitch lines: from coupon to full-wafer experiments
Armini, Silvia; El-Mekki, Zaid; Swerts, Johan; Nagar, Magi; Demuynck, Steven (2013) -
ELD NiB for microbumps passivation and wirebonding
Derakhshandeh, Jaber; De Preter, Inge; El-Mekki, Zaid; Hou, Lin; Gerets, Carine; Dictus, Dries; Vanstreels, Kris; Croes, Kristof; Miller, Andy; Beyer, Gerald; Beyne, Eric (2020) -
Electrical comparison of iN7 EUV hybrid and EUV single patterning BEOL metal layers
Lariviere, Stephane; Wilson, Chris; Kutrzeba Kotowska, Bogumila; Versluijs, Janko; Decoster, Stefan; Mao, Ming; van der Veen, Marleen; Jourdan, Nicolas; El-Mekki, Zaid; Heylen, Nancy; Kesters, Els; Verdonck, Patrick; Beral, Christophe; Van Den Heuvel, Dieter; De Bisschop, Peter; Bekaert, Joost; Blanco, Victor; Ciofi, Ivan; Wan, Danny; Briggs, Basoene; Mallik, Arindam; Hendrickx, Eric; Kim, Ryan Ryoung han; McIntyre, Greg; Ronse, Kurt; Boemmels, Juergen; Tokei, Zsolt; Mocuta, Dan (2018) -
Electrochemical deposition of Sn-Cu alloys for applications in 3D stacking in microelectronics industry
Inoue, Fumihiro; El-Mekki, Zaid; Struyf, Herbert; Hou, Lin; Derakhshandeh, Jaber; Beyne, Eric; Radisic, Alex; Hsia, Chih-Hao; Chang, Iris; Kutner, Elisabeth; Fluegel, Alexander; Arnold, Marco (2020) -
Electrodeposition of Ø50 × 50 μm Cu pillars for 3D stacking applications
El-Mekki, Zaid; Philipsen, Harold; Honore, Mia; Radisic, Alex; Slabbekoorn, John; Arnold, Marco; Fluegel, Alexander; Shu-Ya Chang, Iris; Struyf, Herbert; Mayer, Dieter (2016) -
Electrodeposition of Ø50 × 50 μm Cu pillars for 3D stacking applications
El-Mekki, Zaid; Radisic, Alex; Philipsen, Harold; Honore, Mia; Slabbekoorn, John; Struyf, Herbert; Arnold, Marco; Fluegel, Alexander; Mayer, Dieter; Shu-Ya Chang, Iris (2017) -
Electromigration-driven void nucleation and growth in 30nm wide Cu line: Metal cap impact on interfacial Cu diffusion
Kirimura, Tomoyuki; Croes, Kristof; Siew, Yong Kong; Vanstreels, Kris; Czarnecki, Piotr; El-Mekki, Zaid; van der Veen, Marleen; Dictus, Dries; Yoon, A.; Kolics, A.; Boemmels, Juergen; Tokei, Zsolt (2013) -
Enabling sub 20nm Cu metallization with PEALD Ru-TiN barrier and ELD seed
Siew, Yong Kong; Swerts, Johan; Dictus, Dries; El-Mekki, Zaid; Armini, Silvia; Dordi, Yezdi; Yoon, Alex; Kolics, Artur; Barbarin, Yohan; Croes, Kristof; Boemmels, Juergen; Tokei, Zsolt (2012) -
Enhanced barrier seed metallization for integration of high-density high aspect-ratio copper-filled 3D through-Silicon Via Interconnects
Civale, Yann; Armini, Silvia; Philipsen, Harold; Redolfi, Augusto; Velenis, Dimitrios; Croes, Kristof; Heylen, Nancy; El-Mekki, Zaid; Vandersmissen, Kevin; Beyer, Gerald; Swinnen, Bart; Beyne, Eric (2012)