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Browsing by Author "Lehnen, Peer"

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    A Dy2O3-capped HfO2 dielectric and TaCx-based metals enabling low-Vt single-metal-single-dielectric gate stack

    Chang, Vincent
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    Ragnarsson, Lars-Ake  
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    Pourtois, Geoffrey  
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    O'Connor, Robert
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    Adelmann, Christoph  
    Proceedings paper
    2007, Technical Digest International Electron Devices Meeting - IEDM, 10/12/2007, p.535-538
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    Achieving low VT Ni-FUSI CMOS via lanthanide incorporation in the gate stack

    Veloso, Anabela  
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    Yu, HongYu
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    Lauwers, Anne  
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    Chang, Shou-Zen
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    Adelmann, Christoph  
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    Onsia, Bart  
    Proceedings paper
    2007-09, Proceedings of the 37th European Solid-State Device Research Conference - ESSDERC, 11/09/2007
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    Achieving low-VT Ni-FUSI CMOS via Lanthanide incorporation in the gate stack

    Veloso, Anabela  
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    Yu, HongYu
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    Lauwers, Anne  
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    Chang, Shou-Zen
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    Adelmann, Christoph  
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    Onsia, Bart  
    Journal article
    2008, Solid-State Electronics, (52) 9, p.1303-1311
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    Alternative high-k dielectrics for semiconductor applications

    Van Elshocht, Sven  
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    Adelmann, Christoph  
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    Clima, Sergiu  
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    Pourtois, Geoffrey  
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    Conard, Thierry  
    Journal article
    2009, Journal of Vacuum Science and Technology B, (27) 1, p.209-213
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    Alternative high-k dielectrics for semiconductor applications

    Van Elshocht, Sven  
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    Adelmann, Christoph  
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    Clima, Sergiu  
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    Pourtois, Geoffrey  
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    Conard, Thierry  
    Oral presentation
    2008, 15th Workshop on Dielectrics in Microelectronics - WODIM
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    Anomalous positive-bias temperature instability of high-k/metal gate nMOSFET devices with Dy2O3 capping

    O'Connor, Robert
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    Chang, Vincent
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    Pantisano, Luigi
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    Ragnarsson, Lars-Ake  
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    Aoulaiche, Marc
    Proceedings paper
    2008, IEEE International Reliability Physics Symposium Proceedings, 27/04/2008, p.671-672
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    AVD and MOCVD TaCN-based films for gate metal applications on high-k gate dielectrics

    Karim, Zia
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    Barbar, Ghassan
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    Boissiere, Olivier
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    Lehnen, Peer
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    Lohe, Christoph
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    Seidel, Tom
    Proceedings paper
    2007-10, Physics and Technology of High-k Dielectrics, 7/10/2007, p.557-567
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    Demonstration of low Vt Ni-FUSI N-MOSFETs with SiON dielectrics by using a Dy2O3 cap layer

    Yu, HongYu
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    Chang, Shou-Zen
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    Veloso, Anabela  
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    Lauwers, Anne  
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    Adelmann, Christoph  
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    Onsia, Bart  
    Journal article
    2007-11, IEEE Electron Device Letters, (28) 11, p.957-959
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    Demonstration of metal-gated low Vt n-MOSFETs using a Poly-Si/TaN/Dy2O3/SiON gate stack with a scaled EOT value

    Yu, HongYu
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    Singanamalla, Raghunath
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    Ragnarsson, Lars-Ake  
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    Chang, Vincent
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    Cho, Hag-Ju
    Journal article
    2007, IEEE Electron Device Letters, (28) 7, p.656-658
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    Dielectric properties of dysprosium- and scandium-doped hafnium dioxide thin films

    Adelmann, Christoph  
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    Venugopalan, Sriram
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    Van Elshocht, Sven  
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    Lehnen, Peer
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    Conard, Thierry  
    Journal article
    2007-10, Applied Physics Letters, (91) 16, p.162902
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    DyScHfO as high-k gate dielectric: structural and electrical properties

    Adelmann, Christoph  
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    Van Elshocht, Sven  
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    Lehnen, Peer
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    Conard, Thierry  
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    Franquet, Alexis  
    Proceedings paper
    2007, Advanced Gate Stack, Source/Drain and Channel Engineering for Si-based CMOS 3: New Materials, Processes and Equipment, 6/05/2007, p.113-120
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    Electrical characterization of capacitors with AVD- deposited hafnium silicates as high-k gate dielectric

    Van Elshocht, Sven  
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    Weber, U.
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    Conard, Thierry  
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    Kaushik, Vidya
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    Houssa, Michel  
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    Hyun, Sangjin
    Journal article
    2005, Journal of the Electrochemical Society, (152) 11, p.F185-F189
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    Equivalent oxide thickness reduction for high-k gate stacks by optimized rare-earth silicate reactions

    Van Elshocht, Sven  
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    Adelmann, Christoph  
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    Lehnen, Peer
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    De Gendt, Stefan  
    Journal article
    2009, Electrochemical and Solid-State Letters, (12) 5, p.G17-G19
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    Flat-band voltage shift of Ruthenium gated stacks and its link with the formation of a thin Ruthenium oxide layer at the Ruthenium/dielectric interface

    Li, Zilan
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    Schram, Tom  
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    Pantisano, Luigi
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    Stesmans, Andre  
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    Conard, Thierry  
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    Shamuilia, Sheron
    Journal article
    2007-02, Journal of Applied Physics, (101) 3, p.34503
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    Growth of dysprosium-, scandium-, and hafnium-based third generation high-k dielectrics by atomic-vapor deposition

    Adelmann, Christoph  
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    Lehnen, Peer
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    Van Elshocht, Sven  
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    Zhao, Chao
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    Brijs, Bert
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    Franquet, Alexis  
    Journal article
    2007-10, Chemical Vapor Deposition, 13, p.567-573
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    Improving CMOS performance by AVD® grown high-k dielectrics and advanced metal electrodes

    Weber, U.
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    Boissière, O.
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    Lindner, J.
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    Schuhmacher, M.
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    Lehnen, Peer
    ;
    Manke, C.
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    Van Elshocht, Sven  
    Proceedings paper
    2005, Advanced Gate Stack, Source/Drain, and Channel Engineering for Si-Based CMOS: New Materials, Processes, and Equipment, 15/05/2005, p.293
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    Low Vt Ni-FUSI CMOS technology using a DyO cap layer with either single or dual Ni-phases

    Yu, HongYu
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    Chang, Shou-Zen
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    Veloso, Anabela  
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    Lauwers, Anne  
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    Adelmann, Christoph  
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    Onsia, Bart  
    Proceedings paper
    2007, Symposium on VLSI Technology. Digest of Technical Papers, 14/06/2007, p.18-19
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    Mechanism of O2-anneal induced Vfb shifts of Ru gated stacks

    Li, Zilan
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    Schram, Tom  
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    Pantisano, Luigi
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    Stesmans, Andre  
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    Conard, Thierry  
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    Shamuilia, Sheron
    Journal article
    2007, Microelectronics Reliability, (47) 4_5, p.518-520
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    Metal gate technology using a Dy2O3 dielectric cap approach for multiple-VT in NMOS FinFETs

    Ferain, Isabelle
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    Son, Nak Jin
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    Witters, Liesbeth  
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    Collaert, Nadine  
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    Onsia, Bart  
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    Kaczer, Ben  
    Proceedings paper
    2007, IEEE International SOI conference, 1/10/2007, p.141-142
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    Nitrogen profile and dielectric cap layer (Al2O3, Dy2O3, La2O3) engineering on Hf-silicate

    Cho, Hag-Ju
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    Yu, HongYu
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    Ragnarsson, Lars-Ake  
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    Chang, Vincent
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    Schram, Tom  
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    O'Sullivan, Barry  
    Proceedings paper
    2007, IEEE International Conference on IC Design and Technology - ICICDT, 30/05/2007, p.114-116
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