Browsing by Author "Mitsuhashi, Riichirou"
- Results Per Page
- Sort Options
Publication 45nm LSTP FET with FUSI gate on PVD-HfO2 with excellent drivability by advanced PDA treatment
Journal article2005, Microelectronic Engineering, 80, p.7-10Publication A Dy2O3-capped HfO2 dielectric and TaCx-based metals enabling low-Vt single-metal-single-dielectric gate stack
Proceedings paper2007, Technical Digest International Electron Devices Meeting - IEDM, 10/12/2007, p.535-538Publication Achieving 9ps unloaded ring oscillator delay in FuSI/HfSiON with 0.8 nm EOT
Proceedings paper2007, Symposium on VLSI Technology. Digest of Technical Papers, 14/06/2007, p.198-199Publication Achieving low VT Ni-FUSI CMOS via lanthanide incorporation in the gate stack
Proceedings paper2007-09, Proceedings of the 37th European Solid-State Device Research Conference - ESSDERC, 11/09/2007Publication Achieving low-VT Ni-FUSI CMOS via Lanthanide incorporation in the gate stack
Journal article2008, Solid-State Electronics, (52) 9, p.1303-1311Publication CMOS integration of dual work function phase controlled Ni FUSI with simultaneous integration of nMOS (NiSi) and pMOS (Ni-rich silicide) gates on HfSiON
Proceedings paper2005-12, Technical Digest International Electron Devices Meeting - IEDM, 5/12/2005, p.661-664Publication Current status and addressing the challenges of Hf-based gate stack toward 45nm-LSTP application
;Niwa, Masaaki ;Mitsuhashi, Riichirou ;Yamamoto, K. ;Hayashi, S.Harada, YoshinaoProceedings paper2005-10, Extended Abstracts of the International Conference on Solid State Devices and Materials - SSDM, 13/09/2005, p.6-7Publication Defect profiling and the role of nitrogen in lanthanum oxide-capped high-k dielectrics for nMOS applications
Proceedings paper2008-09, International Conference on Solid State Devices and Materials - SSDM, 24/09/2008, p.680-681Publication Demonstration of metal-gated low Vt n-MOSFETs using a Poly-Si/TaN/Dy2O3/SiON gate stack with a scaled EOT value
Journal article2007, IEEE Electron Device Letters, (28) 7, p.656-658Publication Low VT CMOS using doped Hf-based oxides, TaC-based metals and laser-only anneal
Proceedings paper2007, Technical Digest International Electron Devices Meeting - IEDM, 10/12/2007, p.49-52Publication Low Vt Ni-FUSI CMOS technology using a DyO cap layer with either single or dual Ni-phases
Proceedings paper2007, Symposium on VLSI Technology. Digest of Technical Papers, 14/06/2007, p.18-19Publication Ni-FUSI on high-k as a candidate for 65nm LSTP CMOS
Proceedings paper2005-04, Proceedings IEEE VLSI-TSA International Symposium on VLSI Technology, 25/04/2005, p.99-100Publication Nitrogen profile and dielectric cap layer (Al2O3, Dy2O3, La2O3) engineering on Hf-silicate
Proceedings paper2007, IEEE International Conference on IC Design and Technology - ICICDT, 30/05/2007, p.114-116Publication Optimization of HfSiON using a design of experiment (DOE) approach
Journal article2007, Microelectronics Reliability, (47) 4_5, p.521-524Publication Oxygen-vacancy-induced Vt shift in La-containing devices
Proceedings paper2007, Extended Abstracts of the International Conference on Solid State Devices and Materials - SSDM, 19/09/2007, p.372-373Publication Prospect of Hf-based gate dielectric by PVD with FUSI gate for LSTP application
;Niwa, Masaaki ;Mitsuhashi, Riichirou ;Yamamoto, Kazuhiko ;Hayashi, S. ;Harada, Y.Kubota, M.Meeting abstract2005, Meeting Abstracts 208th Meeting of the Electrochemical Society, 16/10/2005, p.516Publication PVD-HfSiON gate dielectrics with Ni-FUSI electrode for 65nm LSTP application
Journal article2005-06, Microelectronic Engineering, 80, p.198-201Publication Reliability study of La2O3 capped HfSiON high-permittivity n-type metal-oxide-semiconductor field-effect transistor devices with tantalum-rich electrodes
Journal article2008, Journal of Applied Physics, (104) 4, p.44500Publication Strain enhanced FUSI/HfSiON technology with optimized CMOS process window
Proceedings paper2007, Symposium on VLSI Technology. Digest of Technical Papers, 12/06/2007, p.200-201Publication Strain enhanced Low-VT CMOS featuring La/Al-doped HfSiO/TaC and 10ps invertor delay
Proceedings paper2008, Symposium on VLSI Technology Digest of Technical Papers, 17/06/2008, p.130-131